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IC and Hybrid Processing Equipment
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Wedge bonder handles varied wires
The Bondjet BJ820 handles all challenging fine pitch wire bonding applications in a single platform, including RF and microwave devices, COB, MCM and hybrids, fibre optics and automotive applications.
News from Hesse & Knipps ( 8 May 2008)
Flying probes promote precision trimming
Laser trimming systems for capacitors and resistors use flying probes for feedback rather than fixed probe cards for economical operations on small batches.
News from LS Laser Systems (14 April 2008)
Lasers boost semiconductor research
The Powerlase lasers will enable the development of the DPP source for lithography steppers, which are used for the fabrication of semiconductors.
News from Powerlase (10 April 2008)
Silicon engineering to upgrade DRAM production
User application article MST for CMOS will improve overall chip performance and reduce static power without introducing any new materials into existing manufacturing process flows.
News from Mears Technologies (21 March 2008)
Wire bonders move to next generation
Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.
News from Kulicke and Soffa Industries (18 March 2008)
Process tool systems ordered for research complex
Nine systems will provide University of Southampton with leading-edge capabilities in the research and development of novel nanoelectronic, MEMS and photonic devices.
News from Oxford Instruments Plasma Technology (20 December 2007)
Dry etch deprocessing is enhanced
Plasma Accelerator delivers increased etching speeds, superior duplication rates, straightforward operation and low damage.
News from Oxford Instruments Plasma Technology ( 5 December 2007)
Dry etching system offers several tools in one
The PlasmalabuEtchEL provides the clean removal of polyimide, nitrides and oxides to reveal the underlying device structure for the desired analysis.
News from Oxford Instruments Plasma Technology ( 1 November 2007)
Technology allows large wafer production
The AIX 2800G4 HT reactor which is able to handle 50 x 50mm sapphire wafers along with 50.8mm wafers.
News from CrystalQ ( 8 October 2007)
Collaboration targets nano-imprint lithography
Nano-imprint lithography is a versatile, cost-effective, flexible and high-throughput method for fabrication of down to and below 10nm structures.
News from Oxford Instruments Plasma Technology (13 September 2007)
Top power lasers to ramp up plasma production
User application article The introduction of the Powerlase laser systems has significantly altered flat-panel production methods.
News from Powerlase ( 2 August 2007)
Plasma processing systems for the Ivy League
Inductively coupled plasma and plasma enhanced vapor deposition tools to be installed at Harvard University's Center for Nanoscale Systems.
News from Surface Technology Systems ( 6 July 2007)
Hermetic sealing becomes universal package option
All StratEdge high-performance semiconductor packages operating from DC to above 50GHz are now available in hermetic versions.
News from StratEdge ( 1 June 2007)
High power laser is EUV source
New device firmly places the laser produced plasma EUV source approach as the main contender to be the source of choice for the high volume manufacturing of semiconductor chips.
News from Powerlase (29 May 2007)
Moulded ceramics provide leading-edge packaging
Fully hermetic true-low-profile moulded ceramic surface mount packages offer excellent electrical performance from DC to 20GHz.
News from StratEdge (28 May 2007)
NIR devices developed for analyser
Micralyne is mass producing MEMS NIR devices for the Phazir, a handheld device that can perform qualitative and quantitative analysis of materials directly at their source.
News from Micralyne (11 May 2007)
Bonding wire for ICs
MaxSoft bonding wire has fine speed and cost-effectiveness ratings.
News from Kulicke and Soffa Industries (30 April 2007)
Potential changes to Interface A EDA standards
SEMI has accepted once change to the EDA Interface A standards and has balloted on another.
News from Cimetrix (30 April 2007)
Semiconductor company moves headquarters
Vistec Semiconductor Systems has celebrated the opening of its new headquarters in Weilburg, Germany.
News from Vistec Semiconductor Systems (25 April 2007)
Die bonders improve productivity
KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company.
News from Kulicke and Soffa Industries (25 April 2007)
Insulin pump on a patch makes use of MEMS
Mixed-signal chip company teams up with insulin specialist to develop a miniature pump, which can fit on to a skin patch and deliver regular insulin infusions.
News from STMicroelectronics (23 April 2007)
DTI funds high-temperature packaging research
The Uptemp project has been formed with support from a GBP 192,000 grant from the Technology Programme.
News from Micro Circuit Engineering (19 April 2007)
MEMS developments supported in Japan
GenISys has opened an office in Tokyo to provide localised, direct sales and support to its growing Japanese customer base.
News from GenISys (18 April 2007)
Power Package series guards semiconductor devices
A new line of semiconductor packages can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits.
News from StratEdge (17 April 2007)
Project aims for flexible packaging technology
Zarlink has joined a European Commission funded project to develop flexible, highly integrated packages for emerging electronic systems.
News from Zarlink Semiconductor (13 April 2007)
Semiconductor process shrinks from 65 to 55nm
A 55nm process technology is a 90% linear-shrink process from 65nm including I/O and analogue circuits.
News from TSMC (29 March 2007)
Nano-scale tool maker appoints new MD
A provider of flexible tools and processes for the engineering of nanoscale structures and devices has appointed Andy Matthews as its new Managing Director
News from Oxford Instruments Plasma Technology (23 March 2007)
Electron beam system has dual use
The industry proven SB351 can be used for mask writing as well as direct write applications.
News from Vistec Electron Beam (21 March 2007)
Shrinking life cycles good for e-beam lithography
Luncheon Symposium reports on conditions affecting the application of 'electron beam direct write' as a manufacturing technology for semiconductors.
News from Vistec Electron Beam (15 March 2007)
Mask measurements support 45nm and below
Next generation mask metrology tool is designed to support the 45nm technology node and beyond.
News from Vistec Semiconductor Systems (13 March 2007)
Mask measurement handles critical dimensions
SEM-based critical dimension measurement system for photomasks addresses the needs for 45nm technology node photomask production and 32nm process development.
News from Vistec Semiconductor Systems (13 March 2007)
ILT promises many benefits over old technology
Inverse Lithography Technology techniques surpass previous technical stalwarts such as optical proximity correction.
News from Luminescent Technologies ( 6 March 2007)
Two lasers to produce EUV light source
Powerlase and the University of Central Florida have teamed up to develop a Laser Produced Plasma (LPP) EUV light source which uses a combination of two lasers for the first time.
News from Powerlase ( 1 March 2007)
Record turnover for laser specialist
The manufacturer of the world's most powerful nanosecond Q-switched, diode-pumped solid state (DPSS) lasers, has announced record turnover for the financial year ending 31st December 2006.
News from Powerlase (26 February 2007)
Consortium enlists MEMS packaging expertise
The MEAD consortium will develop microelectromechanical systems technology for the defence industry in a MoD-backed project, with GBP 3.2 million of funding over three years.
News from C-Mac Micro Technology (21 February 2007)
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