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IC and Hybrid Processing Equipment
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Wafer scribe takes on delicate dice
The Scribe 100-3 is another machine from PESL developed for the new generation of delicate die wafers.
News from Production Equipment Sales (12 August 2002)
Wafer feeder puts dice onboard
Assembleon has a new wafer feeder option for its Topaz-XiII and ACM component placement machines.
News from Assembléon (10 June 2002)
Wafers clean up without stopping the show
Nitto Denko has developed the world's first cleaning wafer that removes waste from wafer prober absorption tables without having to shut down the testing process.
News from Nitto Denko Corp (21 May 2002)
Preforms seal glass to metal for packaging
Good news for laser diode packaging comes from Production Equipment Sales (PESL) in the shape of the Diemat range of glass preforms for use in hermetically sealing glass to metal.
News from Production Equipment Sales (16 April 2002)
Datacon goes direct in USA and Asia
Datacon Technology is reorganising its international operations with direct subsidiaries in the USA and Asia.
News from Datacon Semiconductor Equipment (20 March 2002)
Programme puts a fine line on lithography
IMEC Industrial Affiliation programmes offer partners the advantages of both reduced costs and early process knowledge.
News from IMEC (20 February 2002)
Wafer scribe handles delicate dice with care
The Scribe 100-3 is the latest machine from Production Equipment Sales (PESL) developed for the new generation of delicate die wafers.
News from Production Equipment Sales ( 6 February 2002)
Die bonder works to micron resolution
New from Production Equipment Sales is the DB-100, a high-accuracy eutectic die bonder with flip chip function and 1um pick/place resolution.
News from Production Equipment Sales (16 January 2002)
Lower thermal resistance for novel BGA package
LSI Logic has released a thermally enhanced EPBGA-T package, designed to provide 20% lower thermal resistance than standard plastic BGA packages.
News from LSI Logic Europe (10 December 2001)
AIT licenses flip chip packages from LSI Logic
LSI Logic and Advanced Interconnect Technologies (AIT) have signed a licensing agreement in which AIT will license LSI Logic's organic laminate flip chip FPBGA technology.
News from LSI Logic Europe (24 October 2001)
Loader keeps wafers moving
Datacon's new stackloader STL2 fits into its modular die bonder concept and can be configured with the 2200 apm, 2200 apm+ and EWR.
News from Datacon Semiconductor Equipment ( 4 October 2001)
Multichip die bonder ready for 300mm wafers
Datacon has released its next generation multichip die bonder.
News from Datacon Semiconductor Equipment ( 3 October 2001)
Orders for semiconductor processing control system
Texcel Technology has won two orders to manufacture, configure, test and install complex control systems for Thermo VG Semicon's advanced semiconductor epitaxy processing machines.
News from Texcel Technology (21 September 2001)
Laser system aids silicon wafer handling
The new UZN21 from Matsushita Electric Works uses LED technology to precisely detect the presence and the position of silicon wafers when mounted in a handling cassette.
News from Matsushita Electric Works UK ( 8 June 2001)
Shipley wins Queen's Award for Enterprise
Shipley Europe has won the prestigious Queen's Award for Enterprise, for its outstanding achievement in international trade.
News from Shipley Europe ( 2 May 2001)
Shipley Europe chemist wins ICT award
Narinder Bains, a 28-year-old chemist working at Shipley Europe, has won the prestigious David Kennedy Memorial Award from the Institute of Circuit Technology, for his contribution to the industry.
News from Shipley Europe (27 April 2001)
Universal dry film resist for laser direct imaging
Shipley has launched the latest in its series of ultraDirect laser direct imaging (LDI) dry film photoresists.
News from Shipley Europe ( 9 April 2001)
Non-liquid stereolithography agreement
3D Systems and DSM Desotech are to develop and market non-liquid stereolithography hardware, software and materials for direct and indirect inline manufacturing processeses. Brochure available
News from DSM Somos (28 March 2001)
Plasma cleaning improves packaging integrity
Production Equipment Sales claims the Itrak plasma cleaning system eliminates delamination, improving wirebond strength, ensuring void-free underfill and giving increased die attachment.
News from Production Equipment Sales (19 March 2001)
Thick-film printer is good enough for solar cells
Thick-film printing to exceptional standards is taken a significant stage further with the DEK-J 2000 from PESL for ceramic and steel-based substrates up to 305 x 305mm.
News from Production Equipment Sales (16 February 2001)
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