IC and Hybrid Processing Equipment

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Alliance focuses on integrated fab solutions

Focused on the continuing demand from semiconductor equipment and chip manufacturers for turnkey connectivity solutions, Asyst Technologies and The Peer Group have formed a strategic alliance.

News from Peer Group (24 July 2003)

National signs up for wire bonders

National Semiconductor has signed a volume purchase agreement (VPA) for the purchase of Maxum wire bonders.

News from Kulicke and Soffa Industries (15 July 2003)

Wire bonders bound for China

Kulicke and Soffa Industries has received a purchase order from Nantong Fujitsu Microelectronics for an additional 50 Nu-Tek ball bonders.

News from Kulicke and Soffa Industries ( 9 July 2003)

Improvement brings award from Intel

Disco Corp has been named a recipient of Intel Corp's prestigious 2002 Supplier Continuous Quality Improvement award, Intel's highest honour for its suppliers.

News from Disco Hi-Tec (13 May 2003)

Pair collaborate on copper and low-k integration

Keithley Instruments is working with Novellus Systems to develop electrical process diagnostic tests for copper and low-k integration. Brochure available

News from Keithley Instruments (17 April 2003)

Contracts pressure Peer Group to Europe

Peer Group, an independent supplier of software integration services to the global semiconductor industry, has picked up significant contracts from a major integrator who has departed the business.

News from Peer Group (26 March 2003)

Wire bonders are a hit in the East

Kulicke and Soffa Industries has shipped its Nu-Tek wire bonders to a semiconductor manufacturer in Thailand.

News from Kulicke and Soffa Industries (18 February 2003)

DSP circuit speeds laser galvanometers

DSPLogix is a novel DSP circuit from NanoVia that allows users to modify, convert or optimise signals used in motion control hardware.

News from NanoVia (18 December 2002)

Deep UV laser scribing system boosts LED yields

Oxford Lasers' new deep UV laser system for scribing and dicing of sapphire wafers offers significant improvements in quality, precision and cost effectiveness over conventional methods.

News from Oxford Lasers ( 2 December 2002)

Illuminator sheds light on semiconductors

NanoVia has solved a variety of machine vision applications, previously deemed impossible, for the microelectronic, telecomms, MEMS and semiconductor industries.

News from NanoVia (25 November 2002)

Laser licence deal meets business target

NanoVia has closed an exclusive deal on its CO2-laser-based HyperVia microvia drilling technology.

News from NanoVia (22 November 2002)

Laser-based drilling technology licensed

NanoVia has closed an exclusive deal on its CO2-laser-based HyperVia microvia drilling technology.

News from NanoVia (19 November 2002)

I/O scheme makes the most of 90nm ASIC wire bonds

Pad on I/O is an industry first for copper/low-K processes in wire bond packaging.

News from LSI Logic Europe (25 October 2002)

Optical platform targets wafer-scale technology

UltraVia is an optical system configuration adapted to efficiently drill high aspect ratio vias and microvias into silicon substrates for wafer scale packaging applications.

News from NanoVia (16 October 2002)

NanoVia looks for partners

NanoVia is discussing options with several of the industry's top semiconductor equipment manufacturers.

News from NanoVia ( 3 October 2002)

Optical system has designs on thin films and OLEDs

NanoVia has developed an optical system design targeting the high-volume manufacture of OLED display devices.

News from NanoVia ( 3 October 2002)

Laser delivery system provides speedy dicing

NanoVia has developed a novel optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes.