Latest news on Electronicstalk categorised by product type
IC and Hybrid Processing Equipment
Archive page 7 of 9
Our RSS feed for IC and Hybrid Processing Equipment press releases
Ball bonders engineered for higher productivity
Kulicke and Soffa Industries has added two new automatic ball bonders to its highly successful Maxum series platform, which already boasts more than 8000 units installed worldwide.
News from Kulicke and Soffa Industries (17 March 2005)
Wedge bonder technology sold off
Kulicke and Soffa Industries has sold its wedge bonder technology to Orthodyne Electronics in Irvine, California.
News from Kulicke and Soffa Industries (17 March 2005)
Cimetrix wins a dozen new customers
Despite a generally sluggish market in the semiconductor equipment business sector, Cimetrix managed to meet its target to gain 12 new major OEM customers for the year 2004.
News from Cimetrix (17 January 2005)
Two new VPs for Cimetrix
After posting three consecutive quarters of profit and on track for a profitable 2004, Cimetrix is strengthening its executive team and realigning two key departments to support growth in 2005.
News from Cimetrix ( 7 January 2005)
More control for wafer polishing
Engis has launched its new SM lapping machine to provide increased productivity to a wider group of users.
News from Engis (UK) (23 November 2004)
Laser micromachining aids ultrasound transducer
User application article The Centre for Ultrasound Engineering (CUE) at the University of Strathclyde is developing novel piezoelectric devices using an Oxford Lasers micromachining system.
News from Oxford Lasers (23 November 2004)
There's no business like show business
Photonex04 saw the public announcement of the appointment of Engis (UK) as sole UK distributor for Universal Photonics.
News from Engis (UK) (19 October 2004)
Gold bonding wire boosts device reliability
Radix is a new gold bonding wire specifically engineered for higher intermetallic stability to improve reliability in the most demanding wire bonding applications.
News from Kulicke and Soffa Industries (15 September 2004)
Conference paper describes novel MMIC package
Labtech has collaborated with TNO Physics and Electronics Laboratory to write a technical paper that will be presented at the European Microwave Conference in Amsterdam.
News from Labtech (27 August 2004)
Universal Photonics lines come to the UK
Photonex04 sees the public announcement of the appointment of Engis (UK) as sole UK distributor for the entire range of Universal Photonics products.
News from Engis (UK) ( 9 August 2004)
Silicon etcher expands MEMS capabilities
MEMS manufacturer Micralyne has completed the installation of an AMS 200 silicon etcher from Alcatel Micro Machining Systems.
News from Micralyne ( 6 August 2004)
Plasma etch system bound for TSMC
Surface Technology Systems has received an order to supply Taiwan Semiconductor Manufacturing Company with a cassette to cassette high-rate ASEHRM plasma etch system.
News from Surface Technology Systems (27 July 2004)
Joint venture produces upgraded plasma system
Advanced Vacuum (AV) has released a new open load plasma system for RIE and PECVD processes called the Vision 300-series.
News from Surface Technology Systems (23 July 2004)
Capillary guide simplifies tool selection
A new comprehensive capillary catalogue will assist packaging assembly engineers in learning more about the latest technological advances in capillary designs.
News from Kulicke and Soffa Industries (22 July 2004)
Software simplifies wafer blade specification
Kulicke and Soffa Industries has developed a novel online hub blade software package designed for faster and easier blade selection.
News from Kulicke and Soffa Industries (21 July 2004)
Shanghai plant comes on stream
The Kulicke and Soffa 13,500m2 manufacturing plant in the Suzhou-Singapore Industrial Park, located near Shanghai, is now shipping cantilever probe cards to global semiconductor companies.
News from Kulicke and Soffa Industries (14 April 2004)
Programme to investigate immersion lithography
IMEC has extended its long-term collaboration with ASML to cover immersion lithography, and is set to launch an industrial affiliation programme on 193nm liquid immersion lithography.
News from IMEC (23 January 2004)
Fine-pitch bonder sets new speedy standard
The Maxumplus is an ultra-high-speed ball bonder for all types of ultra-fine-pitch applications including 35 micron inline pitch.
News from Kulicke and Soffa Industries (13 January 2004)
Speedy scribe whips through wafers
The UltraScribe DP-266 high-speed sapphire scribing system is capable of scribing speeds up to 30mm/s, providing wafer process times that are dramatically shorter than other scribing systems.
News from Oxford Lasers (18 December 2003)
Micromachining systems use solid-state lasers
Oxford Lasers has developed a new range of diode-pumped solid-state laser micromachining systems.
News from Oxford Lasers (28 October 2003)
Earlier news from this category...
Latest news from this category...
