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IC and Hybrid Processing Equipment
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Platform accelerates wafer throughput
The CPX cluster platform enables multiple process chambers to share a common wafer transport system.
News from Surface Technology Systems (12 September 2005)
Small footprint lapping machine on show in Paris
Engis Corp will be exhibiting a range of products, including the new, small footprint Hyprez Microtech AM-15 lapping machine, at the EuMW/GaAs show in Paris, in October.
News from Engis (UK) (30 August 2005)
University adopts maskless lithography
The Durham University Centre for Electronics has purchased a DWL66 maskless lithography system from Heidelberg Instruments.
News from Heidelberg Instruments (29 August 2005)
Saunders takes top job
Surface Technology Systems has appointed John Saunders as Chief Executive Officer.
News from Surface Technology Systems (25 August 2005)
Bosch orders deep reactive ion etch system
Surface Technology Systems has received an order for its new Pegasus deep reactive ion etch system from leading automotive MEMS device manufacturer Robert Bosch.
News from Surface Technology Systems (19 August 2005)
Automation interface goes open source
Cimetrix has granted ISMI a 12-month exclusive licence to distribute Cimetrix Interface A client software, which ISMI will call "EDA Client Connection Emulator".
News from Cimetrix ( 3 August 2005)
Chinese company orders second mask write system
Heidelberg Instruments has received a repeat order for an advanced MW800 system from Supermask Co of Shenzhen, China.
News from Heidelberg Instruments ( 1 August 2005)
Alliance aims to align wire bonding portfolios
Kulicke and Soffa Industries and Microbonds are working on a joint process development project.
News from Kulicke and Soffa Industries (25 July 2005)
Alliance focuses nanotechnology resources
Precision Micro and the University of Birmingham have begun technical and commercial collaboration in the field of micro- and nanoscale structures and components.
News from Precision Micro (21 July 2005)
Capillary cuts wire bonding defects
Kulicke and Soffa Industries has developed a new capillary called Arcus to increase yields and productivity in demanding packaging applications.
News from Kulicke and Soffa Industries (13 July 2005)
Advanced etching comes to the MEMS market
A new deep reactive ion etching system delivers significant improvements in etch process capability, stability and system reliability.
News from Surface Technology Systems ( 1 July 2005)
Continued growth for Micralyne
MEMS component specialist Micralyne has secured two major manufacturing orders and has experienced strong revenue growth for its most recent fiscal year.
News from Micralyne (17 June 2005)
Conference papers divulge Pb-free advances
IMEC reported advances in identification of lead-free (Pb-free) solder materials in four papers at the recent 2005 IMAPS European Microelectronics and Packaging Conference (EMPC).
News from IMEC (16 June 2005)
Multiple-gate FETs star at VLSI symposium
IMEC is announcing several research breakthroughs on new gate-stack technologies and multiple-gate FET (MuGFET) devices this week at the 2005 Symposium on VLSI Technology.
News from IMEC (16 June 2005)
Lab aims to answer materials challenges
A new laboratory in Henley on Thames will provide a resource in the UK for developers looking for technical support and expertise in polishing and thinning of advanced materials.
News from Engis (UK) (16 June 2005)
New office cements Asian presence
Surface Technology Systems has reinforced its commitment to the Asian semiconductor manufacturing market by officially opening the doors to a new, dedicated sales office in Singapore.
News from Surface Technology Systems (27 May 2005)
Speedy performance from benchtop lapping machine
The new, small footprint Hyprez Microtech AM-15 is the latest lapping solution with the ability to take materials from a ground state to 5 angstroms flatness in 1.5h.
News from Engis (UK) (20 May 2005)
Semiconductor equipment pioneer Soffa dies
Albert Soffa, cofounder of Kulicke and Soffa Industries and pioneer of the first wire bonder, died on Sunday 10th April 2005, aged 84.
News from Kulicke and Soffa Industries (13 April 2005)
SAW devices polished off in Nottingham
User application article Researchers at Nottingham Trent University have purchased an Engis polishing and lapping machine to assist their work into the use of acoustic wave devices for use in sensors.
News from Engis (UK) ( 5 April 2005)
Stud bumper boasts 87% speed improvement
The ATPremier is an advanced stud bumping machine claimed to offer many technology advancements specifically designed for the growing flip chip market.
News from Kulicke and Soffa Industries (17 March 2005)
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