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IC and Hybrid Processing Equipment
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Lumb takes the chair
Chris Lumb, President and CEO of Micralyne, is to serve as Chairman of the Board of Directors of CMC Microsystems.
News from Micralyne ( 9 December 2005)
Reader and Nelson come onboard
Innos has appointed Dr Alec Reader and Professor Philip Nelson FREng to its board of directors.
News from Innos ( 6 December 2005)
Tool promises commercial carbon nanotubes
CEVP has developed a fabrication tool to commercialise the revolutionary low temperature carbon nanotube growth process developed by the University of Surrey's Advanced Technology Institute.
News from CEVP ( 2 December 2005)
Die bonder delivers submicron resolution
Designed to meet the needs of high accuracy bonding applications and specifically those of the optoelectronics and semiconductor industries, the Laurier M9 delivers submicron resolution.
News from Accelonix (UK) ( 1 December 2005)
Toyo to expand photomask production
Heidelberg Instruments has received a repeat order for an advanced MW800 system from Toyo Precision Parts, Japan.
News from Heidelberg Instruments (30 November 2005)
Chinese researchers adopt maskless lithography
Nankai University Centre for Optics Research, located in Tianjin, China, has purchased a DWL66 maskless lithography system from Heidelberg Instruments.
News from Heidelberg Instruments (25 November 2005)
Micralyne wins Canadian innovation awards
Micralyne has won the 2005 Canadian Innovation Award for Innovative Business of the Year and the 2005 Canadian Innovation Award for New Technology for its gold-tin solder electroplating process.
News from Micralyne (10 November 2005)
Belgian researchers adopt maskless lithography
Heidelberg Instruments has installed a DWL66 maskless lithography system at Centre Spatial de Liege, located in Liege, Belgium.
News from Heidelberg Instruments (24 October 2005)
Research addresses sub-45nm analogue challenges
A new industrial affiliation programme on analogue/RF CMOS for the 45nm era aims to keep conquering the challenges of the international technology roadmap for semiconductors.
News from IMEC (21 October 2005)
TSMC joins in with sub-45nm CMOS research
Taiwan Semiconductor Manufacturing Company has become a core partner in IMEC's sub-45nm CMOS research programme.
News from IMEC (20 October 2005)
Flip chip bonder aids device miniaturisation
A new flip chip bonder offers an all-in-one process for mounting and bonding in high precision applications.
News from TDK Electronics Europe (14 October 2005)
Naval Research Lab takes to maskless lithography
Heidelberg Instruments, , Heidelberg, Germany, announced the installation of a DWL66 maskless lithography system at the Naval Research Laboratory, Institute of Nanosciences, Washington DC, USA.
News from Heidelberg Instruments (10 October 2005)
Japanese supplier adopts wafer drying process
IMEC has licensed its Rotagoni drying technique to the Precision Machinery Company, Ebara Corporation, Japan, a leading equipment supplier for the semiconductor industry.
News from IMEC ( 7 October 2005)
Small-footprint grinder gets wafers into shape
Engis (UK) has released the new, small-footprint EHG 150AV horizontal grinder with a full suite of accessories.
News from Engis (UK) (21 September 2005)
New centre to focus Belgian and Dutch research
The Holst Centre is a new research centre that will develop future generations of wireless autonomous transducer solutions and systems-in-foil.
News from IMEC (20 September 2005)
Imaging technique to check dielectric properties
An ongoing EPSRC-funded project led by Queen Mary College London is investigating the development of a new imaging technique - scanning photo-induced impedance microscopy.
News from Innos (19 September 2005)
Hardware upgrades immersion lithography
IMEC's ASML XT:1250i step-and-scan system has been upgraded with state-of-the-art hardware.
News from IMEC (19 September 2005)
Chinese plant expands into blades and sockets
Kulicke and Soffa Industries has expanded its facility in Suzhou, China to become fully operational in its manufacturing capabilities to produce both dicing hub blades and test sockets.
News from Kulicke and Soffa Industries (16 September 2005)
Package test technology wins award
Kulicke and Soffa Industries has won a 2005 Advanced Packaging Award in the Semiconductor Assembly and Test Services category for its new Quatrix photolithographic package test technology.
News from Kulicke and Soffa Industries (15 September 2005)
Taiwanese assembler orders wire bonders
Siliconware Precision Industries has placed a series of purchase orders for K and S wire bonders for delivery to its Taichung, Taiwan facility.
News from Kulicke and Soffa Industries (14 September 2005)
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