IC and Hybrid Processing Equipment

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Boulanger takes charge of die bonder operations

Kulicke and Soffa Industries has appointed Richard Boulanger as General Manager of its die bonder operations located in Berg, Switzerland.

News from Kulicke and Soffa Industries (20 November 2006)

Power amplifier package survives Martian duties

User application article One of StratEdge's SE20 power amplifier packages is playing a key role in transmitting signals with information gathered from Mars Exploration Rovers Spirit and Opportunity back to earth.

News from StratEdge (17 November 2006)

Arsenic source speeds MBE growth

The new ECellAs valved arsenic effusion source or "cracker cell" for molecular beam epitaxy is designed for high performance MBE growth of arsenic-containing III-V materials.

News from Oxford Instruments Plasma Technology (13 November 2006)

Micromachining system advances Welsh centre

Oxford Lasers has recently installed the most advanced ultrafast micromachining system of its kind at the Manufacturing Engineering Centre (MEC), Cardiff.

News from Oxford Lasers ( 8 November 2006)

Direct writing technology proved in F1 application

Scientists and engineers from BAE Systems' Advanced Technology Centre in Filton, UK, have developed technology to "write" electrical circuits directly onto surfaces.

News from BAE Systems Aerospace Controls (26 October 2006)

University helps with plasma research

Powerlase has entered into a partnership with the University of Central Florida to further the development of high-power laser produced plasma EUV sources.

News from Powerlase (13 October 2006)

Kulicke and Soffa to acquire Alphasem

Kulicke and Soffa Industries has signed an agreement to acquire Alphasem, a leading supplier of die bonder equipment, from Dover Technologies International.

News from Kulicke and Soffa Industries (13 October 2006)

Enhanced wafer grinder comes to the UK

Engis' enhanced wafer grinding machine, the EHG 170AV, is now available to UK customers.

News from Engis (UK) (10 October 2006)

Mason and Ellwi to help manage expansion

Powerlase has strengthened its senior management layer in preparation of continued dramatic global expansion that has seen the laser innovator achieve 233% year-on-year growth.

News from Powerlase ( 3 October 2006)

Lasers to develop new EUV sources

Powerlase has received an order for its innovative Starlase lasers from the Extreme Ultraviolet Lithography System Development Association (EUVA).

News from Powerlase (29 September 2006)

Plasma source suits larger wafers

Deep reactive ion etch plasma source is compatible with 300mm silicon wafers commonly used in the large scale manufacturing of silicon-based integrated circuits.

News from Surface Technology Systems (14 September 2006)

Alliance focuses on 45nm logic structures

Epion Corporation has entered into a formal joint development programme with the world's number one supplier of microcontrollers.

News from Epion Corporation (12 September 2006)

Magnetoresitive effect could boost storage density

Researchers have demonstrated a novel effect, called coulomb blockade anisotropic magnetoresistance, that points to new classes of nonvolatile logic circuits.

News from Hitachi Europe (10 August 2006)

Deposition systems aid OLED research

Temperature controlled evaporation source deposits sensitive materials used in the research and production of organic light emitting diodes and solar cells.

News from BOC Edwards ( 9 August 2006)

High-power lasers to be represented in Japan

Japan Laser Corporation (JLC) is to promote the latest AO Series nanosecond, Q-switched solid-state lasers manufactured by Powerlase that address a variety of materials processing requirements.