http://www.electronicstalk.com/indexes/categorybrowsemi.html IC and Hybrid Processing Equipment latest news on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Thu, 15 May 2008 08:00:00 UT Thu, 15 May 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 The Bondjet BJ820 handles all challenging fine pitch wire bonding applications in a single platform, including RF and microwave devices, COB, MCM and hybrids, fibre optics and automotive applications. Thu, 08 May 2008 08:00:00 UT Hesse & Knipps http://www.electronicstalk.com/news/hes/hes100.html Laser trimming systems for capacitors and resistors use flying probes for feedback rather than fixed probe cards for economical operations on small batches. Mon, 14 Apr 2008 08:00:00 UT LS Laser Systems http://www.electronicstalk.com/news/lsa/lsa100.html The Powerlase lasers will enable the development of the DPP source for lithography steppers, which are used for the fabrication of semiconductors. Thu, 10 Apr 2008 08:00:00 UT Powerlase http://www.electronicstalk.com/news/poj/poj113.html MST for CMOS will improve overall chip performance and reduce static power without introducing any new materials into existing manufacturing process flows. Fri, 21 Mar 2008 08:00:00 UT Mears Technologies http://www.electronicstalk.com/news/mzh/mzh100.html Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market. Tue, 18 Mar 2008 08:00:00 UT Kulicke and Soffa Industries http://www.electronicstalk.com/news/kul/kul126.html Nine systems will provide University of Southampton with leading-edge capabilities in the research and development of novel nanoelectronic, MEMS and photonic devices. Thu, 20 Dec 2007 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr108.html Plasma Accelerator delivers increased etching speeds, superior duplication rates, straightforward operation and low damage. Wed, 05 Dec 2007 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr107.html The PlasmalabuEtchEL provides the clean removal of polyimide, nitrides and oxides to reveal the underlying device structure for the desired analysis. Thu, 01 Nov 2007 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr106.html The AIX 2800G4 HT reactor which is able to handle 50 x 50mm sapphire wafers along with 50.8mm wafers. Mon, 08 Oct 2007 08:00:00 UT CrystalQ http://www.electronicstalk.com/news/crq/crq103.html Nano-imprint lithography is a versatile, cost-effective, flexible and high-throughput method for fabrication of down to and below 10nm structures. Thu, 13 Sep 2007 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr105.html The introduction of the Powerlase laser systems has significantly altered flat-panel production methods. Thu, 02 Aug 2007 08:00:00 UT Powerlase http://www.electronicstalk.com/news/poj/poj112.html Inductively coupled plasma and plasma enhanced vapor deposition tools to be installed at Harvard University's Center for Nanoscale Systems. Fri, 06 Jul 2007 08:00:00 UT Surface Technology Systems http://www.electronicstalk.com/news/srf/srf119.html All StratEdge high-performance semiconductor packages operating from DC to above 50GHz are now available in hermetic versions. Fri, 01 Jun 2007 08:00:00 UT StratEdge http://www.electronicstalk.com/news/stx/stx111.html New device firmly places the laser produced plasma EUV source approach as the main contender to be the source of choice for the high volume manufacturing of semiconductor chips. Tue, 29 May 2007 08:00:00 UT Powerlase http://www.electronicstalk.com/news/poj/poj111.html Fully hermetic true-low-profile moulded ceramic surface mount packages offer excellent electrical performance from DC to 20GHz. Mon, 28 May 2007 08:00:00 UT StratEdge http://www.electronicstalk.com/news/stx/stx110.html Micralyne is mass producing MEMS NIR devices for the Phazir, a handheld device that can perform qualitative and quantitative analysis of materials directly at their source. Fri, 11 May 2007 08:00:00 UT Micralyne http://www.electronicstalk.com/news/mal/mal111.html MaxSoft bonding wire has fine speed and cost-effectiveness ratings. Mon, 30 Apr 2007 08:00:00 UT Kulicke and Soffa Industries http://www.electronicstalk.com/news/kul/kul125.html SEMI has accepted once change to the EDA Interface A standards and has balloted on another. Mon, 30 Apr 2007 08:00:00 UT Cimetrix http://www.electronicstalk.com/news/cie/cie109.html Vistec Semiconductor Systems has celebrated the opening of its new headquarters in Weilburg, Germany. Wed, 25 Apr 2007 08:00:00 UT Vistec Semiconductor Systems http://www.electronicstalk.com/news/vim/vim113.html KandS recently added the Alphasem family of dies bonders to its product portfolio through its recent acquisition of the company. Wed, 25 Apr 2007 08:00:00 UT Kulicke and Soffa Industries http://www.electronicstalk.com/news/kul/kul124.html Mixed-signal chip company teams up with insulin specialist to develop a miniature pump, which can fit on to a skin patch and deliver regular insulin infusions. Mon, 23 Apr 2007 08:00:00 UT STMicroelectronics http://www.electronicstalk.com/news/stm/stm189.html The Uptemp project has been formed with support from a GBP 192,000 grant from the Technology Programme. Thu, 19 Apr 2007 08:00:00 UT Micro Circuit Engineering http://www.electronicstalk.com/news/mce/mce104.html GenISys has opened an office in Tokyo to provide localised, direct sales and support to its growing Japanese customer base. Wed, 18 Apr 2007 08:00:00 UT GenISys http://www.electronicstalk.com/news/gey/gey102.html A new line of semiconductor packages can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits. Tue, 17 Apr 2007 08:00:00 UT StratEdge http://www.electronicstalk.com/news/stx/stx109.html Zarlink has joined a European Commission funded project to develop flexible, highly integrated packages for emerging electronic systems. Fri, 13 Apr 2007 08:00:00 UT Zarlink Semiconductor http://www.electronicstalk.com/news/mif/mif234.html A 55nm process technology is a 90% linear-shrink process from 65nm including I/O and analogue circuits. Thu, 29 Mar 2007 08:00:00 UT TSMC http://www.electronicstalk.com/news/tsc/tsc116.html A provider of flexible tools and processes for the engineering of nanoscale structures and devices has appointed Andy Matthews as its new Managing Director Fri, 23 Mar 2007 08:00:00 UT Oxford Instruments Plasma Technology http://www.electronicstalk.com/news/oxr/oxr104.html The industry proven SB351 can be used for mask writing as well as direct write applications. Wed, 21 Mar 2007 08:00:00 UT Vistec Electron Beam http://www.electronicstalk.com/news/vio/vio104.html Luncheon Symposium reports on conditions affecting the application of 'electron beam direct write' as a manufacturing technology for semiconductors. Thu, 15 Mar 2007 08:00:00 UT Vistec Electron Beam http://www.electronicstalk.com/news/vio/vio103.html Next generation mask metrology tool is designed to support the 45nm technology node and beyond. Tue, 13 Mar 2007 08:00:00 UT Vistec Semiconductor Systems http://www.electronicstalk.com/news/vim/vim108.html SEM-based critical dimension measurement system for photomasks addresses the needs for 45nm technology node photomask production and 32nm process development. Tue, 13 Mar 2007 08:00:00 UT Vistec Semiconductor Systems http://www.electronicstalk.com/news/vim/vim109.html Inverse Lithography Technology techniques surpass previous technical stalwarts such as optical proximity correction. Tue, 06 Mar 2007 08:00:00 UT Luminescent Technologies http://www.electronicstalk.com/news/lue/lue100.html Powerlase and the University of Central Florida have teamed up to develop a Laser Produced Plasma (LPP) EUV light source which uses a combination of two lasers for the first time. Thu, 01 Mar 2007 08:00:00 UT Powerlase http://www.electronicstalk.com/news/poj/poj110.html The manufacturer of the world's most powerful nanosecond Q-switched, diode-pumped solid state (DPSS) lasers, has announced record turnover for the financial year ending 31st December 2006. Mon, 26 Feb 2007 08:00:00 UT Powerlase http://www.electronicstalk.com/news/poj/poj109.html The MEAD consortium will develop microelectromechanical systems technology for the defence industry in a MoD-backed project, with GBP 3.2 million of funding over three years. Wed, 21 Feb 2007 08:00:00 UT C-Mac Micro Technology http://www.electronicstalk.com/news/cma/cma119.html