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Electronics Manufacturing Materials and Consumables
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Screen service provides fast delivery
Manufacturers of PV cells can combine DEK's precision screens with printers from DEK or third-party suppliers.
News from DEK ( 9 May 2008)
Thermoplastic film helps protect the environment
Several global electronics manufacturers are voluntarily reducing halogenated additives in their products to benefit the environment.
News from Sabic Innovative Plastics ( 7 May 2008)
Relieve tension using unused sockets
Small cable strain relief and retention devices are suitable for a wide variety of consumer and industrial applications.
News from Damage Control Products ( 5 May 2008)
Mobile filter supports eight extraction arms
The MG400 filter system has a low sound level, with a maximum 55dB(A) at 1m, and so there is no noise disturbance in the working area.
News from Link Hamson (23 April 2008)
Ceramic packages mitigate brazing stresses
StratEdge's thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together.
News from StratEdge (18 April 2008)
Spray-on coating is easy foil for ESD
Crystal clear urethane coating adheres to metal, plastic and most other surfaces.
News from Intertronics (18 April 2008)
Thin-film substrate is easier to process
Novel HD alumina substrate offers straight through vias for thin-film applications. Brochure available
News from AdTech Ceramics (14 April 2008)
Manufacturing OS provides productivity boost
Aegis Software's Version 7.0 Manufacturing Operations System (MOS) provides productivity-enhancing features to the manufacturing environment while providing greater operator simplicity and speed.
News from Aegis Europe (10 April 2008)
Production deal secures organic substrate supplies
Substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set.
News from Endicott Interconnect Technologies ( 7 April 2008)
Water-soluble paste cleans up lead-free soldering
Solder paste is billed as a breakthrough in water-soluble technology with the combination of low voiding, excellent wetting behaviour and ease of cleaning.
News from Kester (28 March 2008)
Conformal coatings distributed in Italy
Cabiotec has established a solid reputation within the Italian electronics industry, which will help to further strengthen HumiSeal's presence in the region.
News from HumiSeal Europe (27 March 2008)
Ceramic substrate applications explained
Guide offers electronics engineers the latest design guidelines for standard thick-film and laser machined ceramic substrates.
News from CoorsTek (21 March 2008)
Flexible silicone coating passes IEC61086-2 test
Samples were tested and passed for insulation resistance and breakdown voltage after the damp heat and salt mist experiments.
News from Electrolube (17 March 2008)
Conformal coatings for Southern Africa
PEM Technologies will help to further strengthen HumiSeal's presence in the region and develop its coatings business.
News from HumiSeal Europe (14 March 2008)
Adhesives are specially formulated for LCDs
Single-component LCD adhesives feature excellent resistance to yellowing, with increased light transmission and accurate colour rendering.
News from Intertronics (12 March 2008)
Potting compound covers complex contours
MasterSil 151 has superior electrical insulation properties, high tensile strength and superb optical clarity.
News from Master Bond (12 March 2008)
Polymer potting agent is easy to work
Can be cured in much greater section thickness than most conventional UV type systems, making it ideal for potting and encapsulation applications.
News from Master Bond (11 March 2008)
Material improves OLED display performance
New electron transport material has lower toxicity, lower voltage, higher electroluminescent efficiency, longer lifetime and lower voltage drift.
News from OLED-T ( 3 March 2008)
Dispenser offers fine control of mixing
The DXBG bench dispenser allows the two components of flowable adhesives to be gravity-fed from separate, refillable two-gallon containers through an integral DX dispenser.
News from Mixpac Equipment (29 February 2008)
Pb-free paste survives under the bonnet
Alpha OM-350 with InnoLot alloy has been developed to meet the growing demand for a more robust alloy that provides superior and reliable solder joints.
News from Cookson Electronics (25 February 2008)
PU resins take the stress out of assembly
Two-part polyurethane resins are supplied in universal cartridges and can be dispensed using a standard mastic gun. Brochure available
News from Rapid Electronics (20 February 2008)
Conductive epoxy holds on tight
Silver-filled epoxy-resin system is suited for making electrically conductive connections in sensitive electronic components that are expected to withstand severe service conditions.
News from Master Bond (15 February 2008)
Two-stage filter system goes mobile
Filtronic filter captures all soldering pollutants by using the combination of a HEPA microfilter for particulates in combination with a high performance gas separation filter.
News from Link Hamson (15 February 2008)
PCB laminate is made for high-power LEDs
Environmentally friendly laminate is designed to keep bright and ultrabright LED light engines burning brighter, longer and uniformly.
News from Laird Technologies (13 February 2008)
Lead-free solder wire is kind to tips
No-clean cored solder wire is developed for manufacturers who do not require silver in lead-free materials.
News from Almit Technology ( 8 February 2008)
Conductive elastomer improves in-car multimedia
User application article Using its Cho-Seal 1285 conductive elastomer, Chomerics designed a custom extrusion that improved the performance of a rear windscreen antenna receiver unit.
News from Chomerics Europe ( 7 February 2008)
Small-run metal parts produced fast
Refined to the highest levels to rapidly deliver burr and stress free custom solutions, Tecan offers a 48hr turnaround service for photo-chemical machined (PCM) or 'photo-etched' metal parts.
News from Tecan (18 January 2008)
Silver-filled epoxy for flexible conductive bonds
The flexibility of Elecolit 3653 makes it ideal for applications that are subject to vibration or rapid temperature changes, thermal shock, twisting or buckling.
News from Eurobond Adhesives (16 January 2008)
Medical swabs are safe for electronics
Swabs feature ESD-safe polypropylene handles, and include dissipative foam and ultraclean microfibre-tipped applicators.
News from Puritan Medical Products (31 December 2007)
Potting compound is key to protection
User application article Two-comportment silicone elastomer solution enables a new technology to protect mission-critical electronic components from damage due to heat, shock and vibration.
News from Lord Corporation (12 December 2007)
Guide explains injection moulded ceramics
Capabilities include metallisation with refractory metal or platinum conductors, nickel and gold plating as required, and ceramic material options. Brochure available
News from AdTech Ceramics (22 November 2007)
Help with problems of tin whiskers
Aerco has increased its stock holdings of difficult-to-source nonRoHS-compliant components and is also helping its customers to source alternatives to tin such as gold.
News from Aerco (21 November 2007)
Display film boosts LCD brightness
LCD TVs with DBEF show an increase in backlight efficiency of between 30% to 50% and an increase in TV efficiency of 20% to 30%.
News from 3M Digital Signage (13 November 2007)
Military technology provides moisture protection
Ion-mask enhancement provides manufacturers with a 21st century solution to waterproofing electrical items and componentry.
News from P2i ( 8 November 2007)
Flexible silicone coating to launch in Munich
Fast-drying silicone-based conformal coating is designed to protect printed circuit boards exposed to high humidity environments.
News from Electrolube ( 5 November 2007)
Alcohol wipes improve adhesive bonds
ADH1610 wipes are suitable for the removal of fluxes, light oils, polar soils, dirt, inks and oxides
News from Intertronics ( 2 November 2007)
Placement system provides speed and reliability
High-speed image processing software provides a 100 % quality check of BGA and fine pitch components prior to placement.
News from Contax ( 1 November 2007)
System doubles printing output
DEK's new solution delivers full in-line production at high speed, while occupying a significantly reduced line footprint.
News from DEK (31 October 2007)
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