Electronics Manufacturing Materials and Consumables

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Sealant suits automotive modules

Loctite 5252 is a medium-viscosity, UV and moisture curing sealant for post-assembly use on electronic module enclosures.

News from Henkel Technologies (30 August 2004)

Summit educates technical support team

Indium Corporation of America held its annual global technical summit recently in Clinton, New York.

News from Indium Corporation of America (30 August 2004)

Novel design process boosts package performance

A new custom package design process can yield market differentiating performance while maintaining cost effective solutions. Brochure available

News from AdTech Ceramics (20 August 2004)

Moulding compound handles under-bonnet conditions

Hysol GR725-AG is a high-temperature semiconductor moulding compound ideally suited for under-bonnet automotive applications and capable of withstanding harsh environmental conditions.

News from Henkel Technologies (13 August 2004)

Luxeon diodes placed and soldered in one

A flexible new system is ideal for hot-bar soldering of small volumes Luxeon emitter terminals.

News from Ivas Tech (13 August 2004)

Online tool helps assess lead-free readiness

A new online, interactive tool aims to help manufacturers prepare for a Pb-free work environment.

News from Indium Corporation of America (13 August 2004)

Soldering tips cut the cost of lead-free working

A new family of Weller lead-free soldering tips (LT/LF) from Cooper Tools offers superior operational life at prices up to six times less than those of the current equivalent market leading products.

News from Cooper Tools (11 August 2004)

Table details cleaning solvent compatibility

Indium Corp of America has released the results of a series of cleaning solvent compatibility evaluations.

News from Indium Corporation of America (10 August 2004)

Progressive support for New York users

Indium Corp is now represented in the Central New York area by Progressive Technologies, which will service and sell Indium's complete line of assembly products.

News from Indium Corporation of America ( 6 August 2004)

Handtool speeds contact crimping

Anderson Power Products has developed a versatile hand tool for crimping its PowerMod and Power Drawer series contacts.

News from Anderson Power Products ( 2 August 2004)

Flux eases BGA bumping

WS-364 is a new high viscosity paste-flux for use in BGA bumping and board level attachment.

News from Indium Corporation of America (30 July 2004)

Optical couplant helps LEDs shine brighter

SmartGel is a novel optical couplant that helps LEDs shine brighter, last longer and survive extreme environments.

News from Newgate Simms (28 July 2004)

Moulding compound speeds SIP integration

Hysol GR9810 is a technologically advanced epoxy moulding compound designed for system in package (SIP) on laminate applications.

News from Henkel Technologies (27 July 2004)

Grouping glues famous brands together

Henkel Technologies has begun global initiative to market its industry innovations under a single, comprehensive banner and distance itself from the competition.

News from Henkel Technologies (23 July 2004)

Purity is key for die attach solder wire

Indium Corp's die attach solder wire is manufactured from high-purity (minimum 99.9% pure) materials with controlled oxide levels to enhance wetting performance.

News from Indium Corporation of America (22 July 2004)

Scientist wins award for AuSn solder research

Micralyne Project Scientist, Dr Siamak Akhlaghi, has received a Silver Medal Award from the American Electroplaters and Surface Finishers Society (AESF).