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Electronics Manufacturing Materials and Consumables
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PCB accessories include 12 types of spacers
A new range of printed circuit board (PCB) accessories complements the extensive product portfolio from Moss Plastic Parts.
News from Moss Plastic Parts (25 October 2004)
Bobet covers Arizona
Indium Corporation of America is now represented in the Arizona area by Bobet Corp.
News from Indium Corporation of America (22 October 2004)
Solder paste handles high humidity
Multicore MP218 is a halide-free, no-clean solder paste that is pin-testable and offers broad process windows for both printing and reflow.
News from Henkel Technologies (20 October 2004)
Water-soluble lead-free paste set to clean up
Indium3.1 is a water-soluble Pb-free solder paste with exceptional printing, ideal for fine-pitch applications.
News from Indium Corporation of America (19 October 2004)
New plant to service Taiwan LCD manufacturers
SDK will begin production of high-purity ammonia in Taiwan from May 2005 through a new subsidiary that will build a 1000-ton-a-year plant at Tainan.
News from SDK (18 October 2004)
China facility opens
Indium Corp has opened a new facility in China, combining solder paste manufacturing and quality operations with fully integrated sales and technical support teams.
News from Indium Corporation of America (11 October 2004)
Soft gel grommets cushion PCBs from shock
Gel-Mec's range of soft gel grommets are ideal for cushioning sensitive PCBs and other light components.
News from Gel-Mec UK ( 7 October 2004)
Stencils ensure accurate rework
A new range of PCB rework stencils ensures accurate and repeatable printed results for single component footprints such as QFPs, PLCCs, BGAs, uBGAs and surface-mount connectors.
News from Tecan Components ( 7 October 2004)
Website is gateway to family of global brands
OK International has launched a redesigned and greatly expanded web presence. Brochure available
News from OK International ( 6 October 2004)
Lead-free paste is cool choice for Motorola
After undergoing intense evaluation and technical analysis Multicore LF320 lead-free solder paste has been qualified for use by Motorola.
News from Henkel Technologies ( 5 October 2004)
Materials experts cover US trade shows
Indium Corp of America will be exhibiting at a number of regional SMTA trade shows during the month of October.
News from Indium Corporation of America ( 1 October 2004)
Smaller carbon fibres aid conductivity
VGCF-S is a new grade of carbon nanofibre suitable for addition to resins in which electrical conductivity is required.
News from SDK (29 September 2004)
Flux is optimised for Pb-free wave soldering
Wave solder flux 3592-35 has been specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.
News from Indium Corporation of America (28 September 2004)
DTI grant aids research into nano devices
Applied Microengineering has been awarded a DTI grant of GBP 678,000 to develop a new production tool to help the manufacture of nano devices - the Lobel project.
News from Applied Microengineering (27 September 2004)
Nickel layer stops packages sprouting tin whiskers
Technical background article Agere Systems reckons its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
News from Agere Systems (23 September 2004)
Lee to tell all on lead-free soldering
Dr Ning-Cheng Lee will present a workshop entitled "Lead-free soldering - metallurgical fundamentals, reflow application and challenges", at the CEMCEX Conference.
News from Indium Corporation of America (17 September 2004)
Ceramic packaging expertise on show in Munich
AdTech Ceramics will introduce its multilayer cofire ceramic capabilities at Electronica 2004. Brochure available
News from AdTech Ceramics ( 6 September 2004)
Pb-free explained at Assembly Technology Expo
Indium Corporation of America will exhibit at Assembly Technology Expo (Booth 5631) in Rosemont, Illinois on from 28th to 30th September 2004.
News from Indium Corporation of America ( 6 September 2004)
Green package moulding compund handles 260C reflow
Hysol GR828 is a semiconductor grade moulding compound specifically designed for SO packages with nickel palladium gold (Ni/Pd/Au) or copper silver (Cu/Ag) spot lead frames.
News from Henkel Technologies ( 3 September 2004)
Semiconductor leadframes made to order
Tecan is now routinely producing high-accuracy bespoke semiconductor leadframes it claims deliver a range of inherent benefits compared with traditional "stamped" products.
News from Tecan Components ( 1 September 2004)
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