Latest news on Electronicstalk categorised by product type
Electronics Manufacturing Materials and Consumables
Archive page 27 of 40
Our RSS feed for Electronics Manufacturing Materials and Consumables press releases
Silicone spray protects without taping
AeroCure is a novel silicone spray for electrical connections that protects against moisture and temperature variances without impeding electrical conductivity.
News from Anderson and Associates Aerosol Division ( 1 February 2005)
Wave solder flux cuts out VOCs for Pb-free process
A new wave solder flux is specifically designed to meet the process demands of Pb-free manufacturing.
News from Indium Corporation of America (28 January 2005)
Awards recognise technical writing
Indium Corporation of America recently awarded its annual Silver Quill Award for excellence in technical writing to two employees.
News from Indium Corporation of America (20 January 2005)
Lead-free solder paste has global appeal
Multicore LF318 is a halide-free no-clean pin-testable lead-free solder paste that promises broad process windows for both printing and reflow.
News from Henkel Technologies (17 January 2005)
Epoxy system boasts minimal smoke generation
A new nonhalogenated epoxy resin system offers outstanding flame resistance and minimal smoke generation, even on prolonged exposure to open flames.
News from Master Bond (13 January 2005)
Senior execs to host Pb-free courses at APEX
Indium Corp VP of Technology, Ning-Cheng Lee and Senior Technologist, Ronald C Lasky will both be presenting courses on Pb-free electronic assembly at APEX in Anaheim, California in February.
News from Indium Corporation of America (12 January 2005)
Squeegee blades and lead-free solder paste
Technical background article William E Coleman examines the effects of lead-free solder on squeegee blade performance.
News from Photo Stencil (11 January 2005)
Encapsulants have smart card chips covered
Henkel has three new UV-cure encapsulants for use in smart card IC module manufacturing.
News from Henkel Technologies ( 7 January 2005)
Polycarbonate films help in screening windows
User application article Autoflex PC is being used as a critical component for the construction of an innovative range of electromagnetic interference shielded display windows. Brochure available
News from Autotype ( 7 January 2005)
Centre focuses electronics research
The Henkel Electronics Group has opened its new Irvine, California Research and Applications Centre.
News from Henkel Technologies ( 6 January 2005)
Reclaim service offers new wafers for old
CrystalQ has added wafer reclaim services to its sapphire substrate product range.
News from CrystalQ (31 December 2004)
Stencils smooth transition to lead-free processing
A combination of proven design features will ensure solder paste printing stencils offer the best possible performance when faced with present-day and future challenges facing PCB manufacturers.
News from Tecan Components (22 December 2004)
It's good to be green
SDK has established new green purchase guidelines as part of its corporate social responsibility activities.
News from SDK (21 December 2004)
Epoxy adhesive is ideal for high-speed SMT lines
Loctite 3629 is a low temperature cure epoxy adhesive that is particularly suited to high-speed dispensing on a range of industry standard machines, including ProFlow cassettes for printing.
News from Henkel Technologies (17 December 2004)
Epoxy compound handles hot duties
A new low-viscosity thermally conductive, electrically insolative two-component epoxy compound is ideal for potting, casting, encapsulation and sealing for service temperatures up to 260C.
News from Master Bond (16 December 2004)
Flux targets difficult-to-solder assemblies
A new rosin flux contains a unique formulation making it free of both halides and volatile organic compounds.
News from Indium Corporation of America (16 December 2004)
Distributors meet in Brighton
Indium Corporation of America held a meeting for its European distributors in Brighton, England in conjunction with the biannual SMART (Surface Mount and Related Technology) Conference.
News from Indium Corporation of America ( 9 December 2004)
Swabs simplify RoHS compliance verification
BLT Circuit Services has become the European distributor for LeadCheck swabs.
News from BLT Circuit Services ( 6 December 2004)
Epoxy adhesive aids thermal management
A new two-component room-temperature-curing epoxy adhesive features a particularly high thermal conductivity.
News from Master Bond ( 3 December 2004)
SMEs face burden of new legislation
Technical background article Christos Papakyriacou, MD of Alpha Micro Components, discusses some of the challenges faced by SMEs in the transition to lead-free processing.
News from Alpha Micro Components (30 November 2004)
Earlier news from this category...
Latest news from this category...
