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Electronics Manufacturing Materials and Consumables
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Semiconductor packaging expertise in Singapore
Indium Corporation will feature advanced assembly materials for semiconductor packaging at Semicon Singapore.
News from Indium Corporation of America (14 April 2005)
Pb-free showing in Atlanta and Minneapolis
Indium Corp will be exhibiting its wares at SMTA shows this month in Atlanta, Georgia, and Minneapolis, Minnesota.
News from Indium Corporation of America (12 April 2005)
Lead-free solder materials and chemicals on show
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at SMT Nurnberg 2005.
News from Almit Technology ( 8 April 2005)
Brighton debut for high-speed device programmer
Adaptsys will be introducing a number of advanced component programming, marking and handling solutions at Nepcon UK 2005 (Stand U401).
News from Adaptsys ( 8 April 2005)
Programme sticks range together
A novel solution designed to make life easier for both designers and production specialists will be launched at the upcoming Nepcon Electronics Exhibition in Brighton.
News from Intertronics ( 4 April 2005)
Lead-free PCB assembly in Nuremberg
Indium Corporation will exhibit advanced technology Pb-free PCB assembly materials at SMT/Hybrid/Packaging 2005 in Nuremberg.
News from Indium Corporation of America ( 1 April 2005)
Anweiler moves up to regional role
Indium Corporation has promoted Jeff Anweiler to Northeastern Regional Sales Manager, covering Eastern Canada and the Northeast United States.
News from Indium Corporation of America (28 March 2005)
Flip-chip bonding leads the way in Brighton
Accelonix will be unveiling a number of new products at this year's Nepcon in Brighton.
News from Accelonix (UK) (25 March 2005)
European role for Caramella
The Electronics Group of Henkel has announced promoted Giuseppe Caramella to the position of European Product Manager for Solder Materials.
News from Henkel Technologies (25 March 2005)
Cabinets keep components fresh for reflow
Almit Technology is using Nepcon 2005 to show models from its newest range of Super Dry humidity control cabinets into the UK market.
News from Almit Technology (24 March 2005)
Brighton showing for lead-free materials
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at Nepcon 2005.
News from Almit Technology (24 March 2005)
Advanced assembly materials on show in Munich
Indium Corp will exhibit at Semicon Europa in Munich, Germany from 12th to 14th April 2005.
News from Indium Corporation of America (24 March 2005)
Aerosol products set to clean up onboard
Kaisertech has introduced a new range of Ambersil aerosols plus Servisol soldering products to its consumables range. Brochure available
News from Kaisertech (23 March 2005)
Three move up at Indium
Indium Corp has made three internal promotions.
News from Indium Corporation of America (21 March 2005)
Intel prefers underfill and die attach paste
Henkel Corp has been named a recipient of Intel Corp's Preferred Quality Supplier award for outstanding performance in providing products and services deemed essential to Intel's success.
News from Henkel Technologies (21 March 2005)
Fabric is swift answer to shielding
Swift-Shield is a very flexible conductive fabric that can be used in many applications to protect people and sensitive electronic equipment from interference.
News from Swift Textile Metalizing (18 March 2005)
Pb-free portfolio on show in China
Indium Corporation will exhibit at Nepcon Shanghai Electronics Manufacturing Technology China from 12th to 15th April 2005.
News from Indium Corporation of America (18 March 2005)
Lee to explain lead-free concepts in China
Indium Corp's Vice President of Technology, Dr Ning-Cheng Lee, will present two papers at the Nepcon China Technology Summit on 11th April 2005 in Shanghai, China.
News from Indium Corporation of America (14 March 2005)
LCP-based circuit materials show up in Paris
Rogers Corp will be showcasing its R/flex 3000 family of liquid crystalline polymer based circuit materials at this year's RF and Hyper Exhibition in Paris.
News from Rogers Corp (11 March 2005)
Crimping tools boast powerful performance
Two new compact heavy-duty hydraulic crimping tools use interchangeable hexagonal die sets that can be changed in a matter of seconds.
News from Anderson Power Products (11 March 2005)
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