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Electronics Manufacturing Materials and Consumables
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Novel alloy claims top lead-free performance
A new wave-soldering alloy is claimed to outperform the standard lead free solder bars currently available and so ease the trauma of transition to lead-free assembly.
News from Cookson Electronics (19 September 2005)
Wipes set to clean up stencil operations
Bioact SC-10 wipes are tough, long lasting lint free cloths, saturated in a mixture of organic solvents designed specially for nonaqueous cleaning operations.
News from Cookson Electronics (19 September 2005)
Solder preforms work with pick and place lines
Tape and reel packaged solder preforms allow measured amounts of solder to be deposited accurately, selectively and without special equipment.
News from Cookson Electronics (19 September 2005)
New distributor for France
Indium Corporation of America has signed up Chimie Tech Services as its latest distributor in Europe.
News from Indium Corporation of America (19 September 2005)
Brown turns to flux chemistry
After 3 successful years as Regional Marketing Manager with Cookson Electronics Assembly Materials, Steve Brown is moving into the role of Global Product Manager - Flux Chemistry.
News from Cookson Electronics (16 September 2005)
Solder waste requires special procedures
Cookson Electronics is the UK's largest solder reclaim operation and is highly experienced in the reprocessing of solder dross, paste etc, including meeting all legal and environmental obligations.
News from Cookson Electronics (16 September 2005)
Lead-free range aims for wider process window
Cookson Electronics has focused on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar.
News from Cookson Electronics (15 September 2005)
Stencils claim exceptional paste volume control
Alphaform electroformed stencils are designed for ultra-fine-pitch tolerances in surface mount and microelectronics applications, and for high volume assemblers.
News from Cookson Electronics (15 September 2005)
Heat shrink grommets suit military connectors
Raychem brand Shrinkhoop URHR cable clamp heat shrink grommets allow for ultrahigh shrink ratios up to 10:1. Brochure available
News from Tyco Electronics UK (15 September 2005)
Low cost alternative to chrome plated masks
Microstencil can now offer users of photomasks and photoplotted polyester films a "low cost" alternative to the more commonly used chrome plated masks.
News from MicroStencil (15 September 2005)
Full lead-free range goes on show
Indium Corporation will be exhibiting its Pb-free suite of materials at the Assembly Technology Expo in Rosemont, Illinois, from 26th to 28th September 2005.
News from Indium Corporation of America (12 September 2005)
Showcase for high-performance foams
Rogers Corp and Rogers Inoac Corp will be showcasing Poron, Bisco and NanNex high performance foams for electronic and automotive applications at this year's eMEX.
News from Rogers Corp (12 September 2005)
Solder paste eases process transition
Halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes.
News from Henkel ( 9 September 2005)
Promotion for Cusano
Luigi Cusano has been promoted to the position of Plant Manager for the Henkel City of Industry Facility.
News from Henkel ( 7 September 2005)
Japanese experience aids European Pb-free switch
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at Productronica 2005.
News from Almit Technology ( 5 September 2005)
Applications engineering team expands
Indium Corporation has appointed three new applications engineers.
News from Indium Corporation of America ( 5 September 2005)
Lead-free paste proves popular
BLT Circuit Services reports that to date 48 machines in the UK have been converted to use its nonpatented SACP0307 lead free solder paste.
News from BLT Circuit Services ( 5 September 2005)
If the volume control fits - wear it!
User application article Unveiled this week by Scottevest, the SeV Tactical VC jacket incorporates ElekTex, Eleksen's groundbreaking intelligent and interactive fabric.
News from Eleksen (26 August 2005)
Monomer promises faster photosetting
SDK has developed a new grade of high-performance isocyanate monomer for precision surface treatment of liquid crystal displays (LCDs) and semiconductors.
News from SDK (25 August 2005)
Potting compound boasts superior toughness
A new two-component epoxy-urethane compound called EP30DP is ideal for bonding, sealing and potting applications.
News from Master Bond (25 August 2005)
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