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Electronics Manufacturing Materials and Consumables
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Glass-maker invests in flat panel displays
Schott is investing US $195 million in its melting and processing capacity for TFT-LCD glass for flat panel displays.
News from Schott (29 November 2005)
Novel substrate removes the need for heatsinks
A new substrate technology is claimed to offer significant benefits over conventional polymer-based insulated metal substrates.
News from IRC Advanced Film Division (29 November 2005)
Evaporation masks are robust and accurate
Evaporation masks, for use across a wide range of selective vacuum chamber processes, have been further enhanced by Tecan - combining coplanar rigidity with optimum aperture accuracy.
News from Tecan (28 November 2005)
Joint venture focuses on epoxy moulding compounds
The Henkel Group has acquired a majority stake in Huawei Electronics, a leading manufacturer of epoxy moulding compounds for semiconductors in China.
News from Henkel Loctite Adhesives (25 November 2005)
Concoat joins Chase Specialty Coatings
The highly successful materials business of UK company Concoat has been purchased by the North American Chase Corporation.
News from Concoat (25 November 2005)
Partnerships pave the way to integration
Aegis Europe has signed a number of new technology partnerships with leading production equipment and factory integration system suppliers.
News from Aegis Europe (24 November 2005)
Website demonstrates routes to RoHS compliance
The Farnell InOne website, which attracted over one million visitors last month, now features a novel RoHS web demo.
News from Farnell InOne (22 November 2005)
Distributor supports Romanian expansion
Indium has expanded its sales efforts in Romania with the addition of LTHD Corp as its newest distributor.
News from Indium Corporation of America (15 November 2005)
Adhesiveless all-polyimide flex circuit materials
Rogers Corp is showcasing its 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials for use in cellphone hinge flex and other applications, at this year's Productronica.
News from Rogers Corp (14 November 2005)
Device cools packages during lead-free reflow
Cookson Electronics Assembly Materials announces the launch of Alpha Coolcap thermal protection devices, developed to cool components during high temperature lead-free reflow and rework processes.
News from Cookson Electronics (10 November 2005)
Next dimension in substrate and wafer bumping
Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed.
News from Cookson Electronics (10 November 2005)
Lead-free wave solder alloy with high yield
Since its introduction in early 2004 by Cookson Electronics Assembly Materials, Alpha Vaculoy SACX lead-free wave solder alloy has set a new benchmark for performance.
News from Cookson Electronics (10 November 2005)
Speciality materials for handset applications
A wide range of speciality materials for handset applications are described in a glossy, four-colour product brochure.
News from Rogers Corp (27 October 2005)
Lipari markets advanced circuit materials
David Lipari has been named the new Marketing Manager of the Rogers Corporation Advanced Circuit Materials Division (ACMD), located in Chandler, Arizona.
News from Rogers Corp (26 October 2005)
Key lead-free role for Jensen
Indium Corporation has enhanced its Pb-free programme with the appointment of Tim Jensen as Pb-Free Programme Manager.
News from Indium Corporation of America (26 October 2005)
Trial scheme puts lead-free solders to the test
Farnell InOne is offering engineers the chance to "test and try" two-metre lengths of lead-free solder wire - costing as little as 99p - to enable them to trial the different products.
News from Farnell InOne (24 October 2005)
Pb-free suite on show in Munich
Indium Corporation will be exhibiting its suite of Pb-free electronics assembly materials for WEEE and RoHS compliance at Productronica in Munich, Germany on from 15th to 18th November 2005.
News from Indium Corporation of America (24 October 2005)
Distribution network covers Germanic markets
The Electronics Group of Henkel is preparing to reach out to key regional markets in Germany, Austria and Switzerland with a specialised distribution network for solder wires and fluxes.
News from Henkel Loctite Adhesives (21 October 2005)
Evans wins SMTA Founder's Award
Indium Corporation's President, Greg Evans, received the prestigious Founder's Award at the Annual meeting of SMTA International.
News from Indium Corporation of America (20 October 2005)
Flux remover and coating join lead-free range
UK manufacturer Electrolube will be attending Productronica this year (Stand A3.171), where it will launch two new products to support lead free manufacture.
News from Electrolube (18 October 2005)
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