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Electronics Manufacturing Materials and Consumables
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New name in cable management accessories
Plastic fastener and cable management accessories specialist Heyco is kicking off the new year with a brand new name and the launch of a new 2006 catalogue. Brochure available
News from Anixter Components ( 4 January 2006)
Green circuit materials go on show
Rogers Corp will Showcase a range of "green" high frequency circuit materials at IPC Expo 06 from 8th to 10th February in Anaheim, California.
News from Rogers Corp (27 December 2005)
Conductive preforms promise high bond strength
A new silver conductive epoxy film and preform system features remarkably high resistance to vibration and shock as well as thermal cycling.
News from Master Bond (26 December 2005)
Asian expansion for Indium
Indium Corporation has promoted Tom Lan to the position of Area Sales Manager for Northeast China, where he will focus on developing large key accounts and continue to lead the sales team.
News from Indium Corporation of America (21 December 2005)
IC adhesives optimised for lead-free processing
Selected Loctite Chipbonders are not only capable of running lead-free, but are designed to optimise lead-free processes, eliminating chip loss and saving components by low temperature curing systems.
News from Henkel Loctite Adhesives (20 December 2005)
Adhesive conducts 40% more heat
Novel technology presents superior levels of thermal conductivity, unique process advantages and excellent reliability on a wide range of substrates.
News from Henkel Loctite Adhesives (14 December 2005)
Flux remover and coating are made for lead-free
New from Electrolube at Productronica, LFFR is a lead free flux remover specially designed to work on boards produced using lead free processes.
News from Electrolube (12 December 2005)
Conformal coating is safer to use
Aquacoat Plus is a water-based conformal coating specifically formulated for the protection of electronic circuitry.
News from Electrolube (12 December 2005)
Cable ties handle severe conditions
A new extended range of stainless steel cable ties is able to withstand the most severe environmental conditions in both indoor and outdoor applications. Brochure available
News from Tyco Electronics UK (12 December 2005)
Learn all about nickel-coated graphite fillers
Hart Coating Technology has published a brief technical information bulletin describing the properties and applications of nickel-coated graphite fillers.
News from Hart Coating Technology (12 December 2005)
Training helps Ultra to lead-free certification
Advanced Rework Technology has helped Ultra CEMS to become one of the first companies in the UK to obtain IPC certification for its staff to the newly released version of IPC-J-STD-001D.
News from Advanced Rework Technology ( 9 December 2005)
Wood leads Europe with latest qualification
Thanks to training from Advanced Rework Technology (ART), Andrew Wood from Thales Land and Joint has become one of the first people in Europe to attain the latest IPC training certification.
News from Advanced Rework Technology ( 9 December 2005)
Engineered fluids replace restricted solvents
3M is offering plain language guidance to the selection and use of its comprehensive range of solvent replacement products in the run up to the Solvent Emissions Directive.
News from 3M Electronic Materials ( 7 December 2005)
Encapsulants answer lead-free demands
Two new high-purity dam and fill encapsulants are designed specifically for lead-free processing.
News from Henkel Loctite Adhesives ( 7 December 2005)
Howard moves up to global role
Indium Corporation has promoted Tony Howard to the position of Global Account Manager, responsible for promoting Indium's product and services by focusing on several key global accounts.
News from Indium Corporation of America ( 7 December 2005)
When all is SED and done
Technical background article Manufacturers are under regulatory pressure to reduce this risks associated with solvent use; here Mark Nursall looks at the options available.
News from 3M Electronic Materials ( 6 December 2005)
Lead-free wire is kinder on soldering iron tips
A new formulation of Pb-free solder wire is designed to minimise the leaching of soldering iron tips and reduce the cost of tip degradation common at higher lead-free process temperatures.
News from Almit Technology ( 6 December 2005)
Novel no-flow underfill wins technology award
Indium Corporation has received the Global Technology Award for its NF260 no-flow underfill.
News from Indium Corporation of America ( 5 December 2005)
Mould compounds pass the lead-free test
The Electronics Group of Henkel has announced the recent customer qualification of a lead-free SOIC package, a result of the company's complete material sets expertise.
News from Henkel Loctite Adhesives (30 November 2005)
Component taping system has universal appeal
An automatic component taping system is claimed to offer users outstanding flexibility and exceptional reliability.
News from Adaptsys (29 November 2005)
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