Electronics Manufacturing Materials and Consumables

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Santec to represent Indium

Santec Marketing has joined Indium Corporation as a sales representative in Sonora, Mexico.

News from Indium Corporation of America ( 2 February 2006)

New team bolsters technical support

A new customer support mechanism is designed to deliver unprecedented levels of service and materials expertise for customers in the Americas.

News from Henkel Loctite Adhesives ( 1 February 2006)

Soft seal foam keeps displays safe from dust

Poron Soft Seal foam is a new formulation of microcellular urethane specifically designed for dust sealing and gap filling within enclosures housing sensitive electronics.

News from Rogers Corp (31 January 2006)

Conductive plastics create ESD-safe packaging

Corrugated conductive plastics are ideal for producing customised packaging and static safe storage solutions.

News from TBA Electro Conductive Products (30 January 2006)

Wave solder flux scores a hat-trick

A powerful new wave solder flux combines the benefits of residue-free performance, coverage of mixed-technology and through-hole applications and the ability to work with both Pb-free and SnPb solder.

News from Indium Corporation of America (26 January 2006)

Spray cleaner offers greener alternative

The Kolb PS range of aqueous cleaning systems rely on eco-friendly odourless solvent-free water-based detergents.

News from Contax (25 January 2006)

Ceramic substrates provide polished performance

Polished ceramic substrates promise improved edge definition on transmission lines and distributed circuit elements.

News from IRC Advanced Film Division (25 January 2006)

Continued focus pays off for ASML

ASML Holding has announced its 2005 annual and fourth quarter results.

News from ASML (20 January 2006)

Poster provides advice on PCB soldering

Phoenix Contact has relaunched its A2 size wall mounting poster providing advice on PCB soldering techniques to the IPC-A-610C standard.

News from Phoenix Contact (19 January 2006)

Solvents and coatings set for first US showing

APEX 2006 will see the US debut of two new products to support lead free manufacturing.

News from Electrolube (16 January 2006)

Toleno to address SMTA in Toronto

Dr Brian Toleno will speak at the upcoming meeting of the Surface Mount Technology Association's Toronto, Canada Chapter.

News from Henkel Loctite Adhesives (16 January 2006)

Silver preforms stick to conducting

A new silver conductive epoxy film and preform system cures very quickly at moderately elevated temperatures and features very high electrical conductivity.

News from Master Bond (13 January 2006)

Aqueous conformal coating makes APEX debut

Electrolube will be promoting its new aqueous conformal coating Aquacoat Plus at APEX this year.

News from Electrolube (13 January 2006)

Papers explain stencil technologies

Photo Stencil will present two papers at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit.

News from Photo Stencil (12 January 2006)

Penang is new base for Asian applications

Alphasem will officially open its new application and training center in the industrial district of Penang on 20th January 2006 to further strengthen process and application support in Southeast Asia.

News from Alphasem (11 January 2006)

Single-component stencils speed rework operations

Novel rework stencils ensure accurate and repeatable printed results for single component footprints, such as QFPs, PLCCs, BGAs, micro-BGAs and surface-mount connectors.

News from Tecan (11 January 2006)

Low-pressure moulding process to star at APEX

The Electronics Division of Henkel will again use APEX as the stage to promote one of its most innovative process solutions: Macromelt low-pressure moulding.