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Electronics Manufacturing Materials and Consumables
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Tiny hard disk finds handset home
SDK's 0.85in-diameter hard disk media, the smallest in the world, have been adopted by Toshiba Corporation in its latest mobile phone.
News from SDK ( 9 March 2006)
Thermally conductive adhesive in the showcase
Loctite 3876 was chosen to be part of the IPC's Innovative Technology Showcase at the recent APEX show in Anaheim.
News from Henkel Loctite Adhesives ( 9 March 2006)
Lead-free presentation to emphasise reliability
Indium Corporation's Vice President of Technology, Dr Ning-Cheng Lee, will emphasise reliability in a presentation to be delivered at the Intel Lead-Free Symposium in Scottsdale, Arizona.
News from Indium Corporation of America ( 8 March 2006)
Thermal reliability in the spotlight
Indium Corporation will present its thermal reliability technology programme at Semi-Therm in Dallas.
News from Indium Corporation of America ( 2 March 2006)
Solder pots deal with lead-free dross
New solder pots automatically create a dross-free zone for fast, reliable and efficient soldering with lead-free solders.
News from Solbraze ( 1 March 2006)
Water-soluble flux works with both processes
WF-1010 is a novel VOC-free water-soluble wave solder flux that is effective for use with both Sn/Pb and Pb-free assemblies.
News from Indium Corporation of America (27 February 2006)
Microlithography conference hears of advances
ASML Holding has presented its latest advances in leading-edge production technology as well as its research and development progress at SPIE Microlithography 2006 in San Jose, California.
News from ASML (23 February 2006)
Gap-filling material is easy to apply
Gap Filler 2000 is a high-performance thermally conductive electrically isolating liquid gap-filling material supplied as a two-component room or elevated temperature curing system.
News from Bergquist Company (22 February 2006)
Website focuses on "green" materials
Rogers Corp has set up a new "Green Leader" website, which contains information on Rogers' environmentally friendly specialty materials, and related subjects.
News from Rogers Corp (20 February 2006)
Reclamation specialist meets environmental mark
Precious metals reclamation specialist Phoenix County Metals has achieved accreditation to ISO14001 at the first attempt.
News from Phoenix County Metals (17 February 2006)
Nepcon stand to feature 14 demonstrations
Production automation specialist Contax will be exhibiting on stand D20 at Nepcon UK from 9th to 11th May 2006 at the NEC, Birmingham.
News from Contax (17 February 2006)
Underfill cures rapidly at low temperatures
Loctite 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages.
News from Henkel Loctite Adhesives (17 February 2006)
No-flow underfill wins award at APEX
NF260 No-Flow underfill won the 2006 Vision Award at the APEX show in Anaheim, California.
News from Indium Corporation of America (16 February 2006)
Novel wafer structure boosts heat dissipation
Available now from extreme materials developer Group4 Labs, is a revolutionary gallium nitride (GaN)-on-diamond semiconductor wafer.
News from Group4 Labs (15 February 2006)
Lead-free solder paste handles finer pitches
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.
News from Henkel Loctite Adhesives (15 February 2006)
Clips put a new barb on applying PCB screens
New technology can significantly cut the production time needed to solder large RFI screening cans and fences onto printed circuit boards
News from Tecan (13 February 2006)
Third-party study confirms stencil superiority
Photo Stencil has published the results of a comparison study between AMTX (Advanced Microfabrication Technology Xerox) E-Fab electroform and laser-cut electroform nickel foil.
News from Photo Stencil ( 8 February 2006)
Fischer to focus on lead-free in the Americas
Henkel Corporation's Electronics Group has appointed Dr Gordon Fischer to the position of Vice President of Sales, Marketing and Technical Service for the Americas.
News from Henkel Loctite Adhesives ( 6 February 2006)
Agile and Paratek settle dispute
Agile Materials and Technologies and Paratek Microwave have reached a settlement agreement on all litigation between the two parties.
News from Agile Materials and Technology ( 3 February 2006)
Diffuser films clear up handheld displays
An innovative range of diffuser films is designed to be used for LCDs and LED displays in mobile phones, digital cameras, GPS units, PDAs and notebook PCs. Brochure available
News from MacDermid Autotype ( 2 February 2006)
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