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Slotless gaskets promise top shielding performance

New slotless beryllium copper EMI/RFI shielding strips are designed to offer improved shielding and ultimate strength.

News from TBA Electro Conductive Products (21 April 2006)

IEEE award for soldering expert Lee

Dr Ning-Cheng Lee has been chosen to receive the 2006 Exceptional Technical Achievement Award IEEE Components, Packaging and Manufacturing Technology Society.

News from Indium Corporation of America (20 April 2006)

No-flow underfill stars in Shanghai

NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China.

News from Indium Corporation of America (18 April 2006)

Patent infringement claims settled

Rogers Corp has settled its patent infringement claims against Isola USA Corp, Isola Laminate Systems Corp and Isola.

News from Rogers Corp (18 April 2006)

Underfill technologies explained at symposium

Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.

News from Henkel Loctite Adhesives (18 April 2006)

Die bonder to enable microphone expansion

User application article Alphasem's semiconductor technology has been evaluated by Knowles for its leading edge manufacturing process of semiconductor microphones.

News from Alphasem (14 April 2006)

Device packager has smaller components taped

The popular V-Tek TM-4450 is now available with support for taping of small devices including SOT23, 0805 and 0603 packages.

News from Adaptsys (14 April 2006)

High fill/flow bondply set for microwave symposium

The new RO4450B-dx bondply is a high fill/flow version of the industry standard RO4450B high frequency circuit material.

News from Rogers Corp (12 April 2006)

Tooling system provides uniform support

Photo Stencil is now the exclusive North American distributor for Novatec's underboard support product, VacuNest.

News from Photo Stencil (12 April 2006)

Wave solder flux is environmentally friendly

Alpha EF-6100 low-solids wave solder flux is the latest addition to the EF Series of environmentally friendly fluxes

News from Cookson Electronics (11 April 2006)

Shenzhen plant meets standards trifecta

On 7th March 2006, BSI officially presented three Business Management Certificates to Cookson Electronics' executives at their site in Shenzhen, China.

News from Cookson Electronics (11 April 2006)

Award recognises help with switch to lead-free

Frost and Sullivan has selected Aegis Industrial Software Corp as its 2006 company of the year in the surface mount technology software sector.

News from Aegis Europe (10 April 2006)

Rep's outstanding service is recognised

Indium Corporation has recognised Creyr Innovation, a representative for its assembly materials, for outstanding service and contributions during 2005.

News from Indium Corporation of America (10 April 2006)

GaN-on-diamond wafer adds an extra option

Group4 Labs has released a gallium-facing gallium-nitride-on-diamond semiconductor water.

News from Group4 Labs ( 7 April 2006)

Alliance on chemical mechanical planarisation

TMP and BASF have entered into a licence and joint development agreement for copper and barrier CMP slurries.

News from BASF ( 6 April 2006)

Santhanasamy joins Asia-Pacific operations

Damian Santhanasamy has been recruited as Technical Engineer at Indium Corporation's Asia-Pacific Operations.

News from Indium Corporation of America ( 5 April 2006)

Distributor takes electrochemicals to Thailand

Electrolube has strengthened its commitment to expanding business in Asia by announcing the appointment of N-Thai Electronics as exclusive distributor in Thailand.