Electronics Manufacturing Materials and Consumables

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Sealant shields and resists corrosion

Material is ideal for use between aluminium surfaces on outdoor enclosures where environmental sealing, plus EMI shielding and resistance to galvanic corrosion are required.

News from Chomerics Europe (26 March 2007)

Distributor supports Arizona manufacturers

KTEC Equipment and Supplies will distribute solder pastes, rework fluxes, wave fluxes, flux-cored wire, solder bar, solid wire, and tape and reel solder preforms throughout Arizona.

News from Indium Corporation of America (23 March 2007)

High-k materials enable IC advances

Recent advances by major semiconductor manufacturers to develop 45nm semiconductor chips have been made possible through the use of high-k materials in the gate dielectric.

News from Air Products (22 March 2007)

Manufacturing software set for upgrade at Nepcon

Aegis Industrial Software will showcase the Version 7 evolution of its proven NPI and MES software system on Stand L28 at Nepcon 2007 in Birmingham, UK.

News from Aegis Europe (21 March 2007)

Adhesive answers Chinese electronics demands

First controlled-volatility thermally conductive adhesive designed and developed specifically for customers in China and Taiwan.

News from Dow Corning (21 March 2007)

Ceramic processes explained by product guide

AdTech Ceramics, specialising in advanced technical ceramic solutions in a wide variety of materials, has published a new design and capabilities guide. Brochure available

News from AdTech Ceramics (21 March 2007)

Electronic materials on show in Shanghai

Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products.

News from Huntsman Advanced Materials (20 March 2007)

Troubleshooting and reliability in focus

Lecture on lead-free electronics assembly at the SMT/Hybrid/Packaging Conference in Nuremberg, Germany, will emphasise troubleshooting and finished goods reliability.

News from Indium Corporation of America (19 March 2007)

Shielding gaskets are RoHS compliant

Range of beryllium copper fingerstock gaskets for EMI shielding meets the Restriction of Hazardous Substances Directive 2002/95/EC.

News from TBA Electro Conductive Products (19 March 2007)

Hard-coated polyester film for cell phone screens

A hardcoated polyester film has been specially designed to offer excellent levels of clarity and scratch resistance for the displays of communications devices such as mobile phones. Brochure available

News from MacDermid Autotype (19 March 2007)

Leading-edge solder technologies at Nepcon

Almit Technology will showcase a range of leading-edge solder technologies at this year's Nepcon exhibition, being held at the Birmingham NEC from 15th to 17th May.

News from Almit Technology (15 March 2007)

Adhesive films and preforms set for Nepcon launch

Ellsworth Adhesives has confirmed plans to launch its new Techfilm product range at Nepcon 2007, where it will also showcase a range of established technologies.

News from Ellsworth Adhesives (13 March 2007)

Multilayered film keeps LCDs safe from damage

Removable film helps protect LCDs from scuffs, scratches and fingerprint damage.

News from 3M Digital Signage (13 March 2007)

Cored wire solder is lead free

Synthetic polymer technology cored wire solder delivers excellent wetting, bright solder joints and clear, noncorrosive residues.

News from Parkheath ( 9 March 2007)

ASML completes Brion Technologies acquisition

Brion's products and technology will complement and reinforce ASML's core lithography business.

News from ASML ( 9 March 2007)

Lead-free alloy saves on silver

Modified tin copper alloy offers outstanding performance without any silver content, making it an economical alternative to lead-free solders containing 3-4% silver.