Electronics Manufacturing Materials and Consumables

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Foundry and logic customers boost ASML take

ASML Holding has announced 2007 first quarter results reflecting 53% growth year on year.

News from ASML (23 April 2007)

Preische targets metals and chemicals

Indium Corporation has appointed David Preische as the new Director of Sales for its Metals and Chemicals Division.

News from Indium Corporation of America (19 April 2007)

Expertise in adhesives spans several industries

Expertise in the application of adhesives for crucial applications allows adhesive specialist to address special needs of medical sector.

News from Intertronics (18 April 2007)

Productivity company moves to larger facility

Growing sales have prompted Adaptsys to move to a much larger facility in Petersfield, Hampshire.

News from Adaptsys (17 April 2007)

Soldering and reliability in the spotlight

Dr Ning-Cheng Lee will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto.

News from Indium Corporation of America (16 April 2007)

Materials alliance to expand printed electronics

BASF Future Business is working with US company Polyera Corporation to develop and commercialise new organic semiconductors and dielectrics for use in CMOS-analogue printed circuits.

News from BASF (16 April 2007)

Green conformal coating passes muster

Electrolube has revealed the successful test results of its sprayable water based conformal coating, WPBs, by ViTechnology.

News from Electrolube (16 April 2007)

Berntson takes charge of solder materials

Ross Berntson has been promoted to Vice President of the Indium Corporation Solder Products Business Unit.

News from Indium Corporation of America (13 April 2007)

Mesler takes charge of finances

Mark Mesler will help drive Aquest's global business model as the company moves to commercialise its breakthrough automation technologies.

News from Aquest Systems (13 April 2007)

Bioplastic composite to make heatsinking packages

Innovative bioplastic has potential to make electronic products more environmentally sound, while solving conventional heat release issues.

News from NEC (12 April 2007)

Polyurethane resins go under the bonnet

Flexible resins operate continuously at 155C and fulfil the stringent Class F requirements.

News from ALH Systems (10 April 2007)

Manufacturing centre of excellence for Taipei

A manufacturing equipment maker is to establish a centre of excellence near Taipei to focus on technology and applications development, equipment support, training, logistics, and refurbishment.

News from ASML ( 9 April 2007)

Solder pastes suffer from tin and silver rises

Indium Corporation has placed a surcharge on its silver- and tin-containing solder paste products, effective immediately.

News from Indium Corporation of America ( 6 April 2007)

Adhesives encapsulate, insulate and bond

A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs.

News from Huntsman Advanced Materials ( 3 April 2007)

Sales rep covers northeastern states

Indium Corp has appointed LFG Micro as a sales representative in the Northeast USA, covering New Jersey, Eastern Pennsylvania and Southeastern New York State.

News from Indium Corporation of America ( 2 April 2007)

Tin market boom puts surcharge on solder

Cookson Electronics Assembly Materials has placed a surcharge on its Alpha brand tin-bearing solder pastes, effective 30 days from customer notification.

News from Cookson Electronics ( 2 April 2007)

Scholarship fund honours retiring chairman

A scholarship fund set up as a tribute to Henk Bodt, retiring Chairman of the ASML Supervisory Board, funds up to 40 master's degree students per year.

News from ASML ( 2 April 2007)

Staff changes support product marketing

Indium Corp has promoted Seth Homer to Product Support Specialist for Engineered Materials and hired Rui "Anny" Zhang as Product Specialist for Solder Paste Products.