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Electronics Manufacturing Materials and Consumables
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Waveguide finishes offer choice of properties
Gold- and silver-based plating finishes provide flexible surface properties for custom waveguides in aerospace, defence, medical, security scanning and comms applications.
News from Tecan (24 October 2007)
Coating suits high volume applications
1H20 AR3 can protect electronics assemblies at temperature extremes far beyond the capabilities of existing resin-based alternatives.
News from HumiSeal Europe (17 October 2007)
Ionic liquid partnership targets solar cells
A partnership between G24 Innovations (G24i) and BASF aims to improve both the performance and efficiency of G24i's solar cells using a proprietary dye-sensitised thin film technology.
News from BASF (12 October 2007)
Coating avoids VOC use
NVOC has been produced for application via select spray equipment and to replace solvent-based coatings with minimal changes to processing parameters.
News from Electrolube (12 October 2007)
Silver conductor pastes suit solar cells
The D-110, D-112 and D-114 silver conductor pastes are targeted at display bus bar electrodes.
News from Five Star Technologies ( 5 October 2007)
Ceramics expertise on show in Stuttgart
Injection moulding technology combines a proven alumina material system with cofire metallisation, and offers complex shape capabilities with no additional machining required. Brochure available
News from AdTech Ceramics (24 September 2007)
Polymer company tailors solutions
Simply specifying a chemistry presupposes a solution without a review of other complex factors and specific performance requirements, which will likely result in a suboptimum solution.
News from Lord Corporation (19 September 2007)
Deposition masks suit vacuum applications
Tecan's electroforming process produces tightly toleranced display masks with burr-free aperture edges and controllable draft angles to ensure optimum print definition.
News from Tecan (10 September 2007)
Encapsulant and potting agents are made for solar
Materials remain flexible and stable over wide temperature variations and offer easy reparability and global availability.
News from Dow Corning ( 7 September 2007)
PCB laminates answer RF demands
Laminates provide the controlled relative permittivity, low loss and passive intermodulation response required by the wireless infrastructure market.
News from Rogers Corp ( 7 September 2007)
Assembly labels resist high temperatures
Use of a green high-temperature label at the start of the process reduces both the number of labels required, and the number of label placements, providing a significant cost saving.
News from Link Hamson (31 August 2007)
Copper substrate handles high-current use
TT electronics IRC Advanced Film Division's cost-effective, solderable thick film copper substrate is now being specified for high-current and power module applications.
News from IRC Advanced Film Division (30 August 2007)
Encapsulants suit lead-free soldering
ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required.
News from Lord Corporation (28 August 2007)
Alliance addresses LED backlight expansion
Agreement gives Laird Technologies access to Iteq's high volume lamination capabilities and AP distribution and gives Iteq access to Laird Technologies' high performance T-lam materials.
News from Laird Technologies (27 August 2007)
3D interconnect structure recognised with patent
Patent covers new methods for making 3D liquid crystal polymer (LCP) interconnect structures using a high-temperature single-sided LCP and a low-temperature single-sided LCP.
News from Jacket Micro Devices (23 August 2007)
Dummy component lines brought up to date
Free catalogue is organised by package type and category with each product accompanied by drawings, description, part number with special attention to lead-free availability and formulations.
News from Practical Components (15 August 2007)
Ink system enables record-breaking cells
Organic photovoltaic technology establishes a new world record for single layer organic solar cells as certified by the US National Renewable Energy Laboratory.
News from Plextronics (10 August 2007)
Laminate system cleans up flex circuit designs
Halogen-free transparent epoxy polyimide laminate system is safe for the environment and delivers superior performance in an all-inclusive package for flexible circuit designs.
News from Rogers Corp ( 7 August 2007)
Labels meet Japanese RoHS requirements
Japanese RoHS labels allow exporters to mark electrical and electronic equipment in accordance with the Japanese Industrial Standard JIS C 0959:2005.
News from LGInternational ( 6 August 2007)
Greener coating passes machine trials
User application article Specialist manufacturer of high quality automated and manual adhesive dispensing and selective spray coating equipment evaluates water-based conformal coating.
News from Electrolube ( 3 August 2007)
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