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    <title>Electronics Manufacturing Materials and Consumables latest news on Electronicstalk</title>
    <link>http://www.electronicstalk.com/indexes/categorybrowsemm.html</link>
    <description>Electronics Manufacturing Materials and Consumables latest news on Electronicstalk</description>
    <language>en-gb</language>
    <copyright>Copyright (C)2008 Pro-Talk Ltd. All rights reserved.</copyright>
    <pubDate>Wed, 14 May 2008 08:00:00 UT</pubDate>
    <lastBuildDate>Wed, 14 May 2008 08:00:00 UT</lastBuildDate>
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    <item>
      <title>Screen service provides fast delivery</title>
      <description>Manufacturers of PV cells can combine DEK's precision screens with printers from DEK or third-party suppliers.</description>
      <pubDate>Fri, 09 May 2008 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek279.html</link>
    </item>
    <item>
      <title>Thermoplastic film helps protect the environment</title>
      <description>Several global electronics manufacturers are voluntarily reducing halogenated additives in their products to benefit the environment. </description>
      <pubDate>Wed, 07 May 2008 08:00:00 UT</pubDate>
      <category>Sabic Innovative  Plastics</category>
      <link>http://www.electronicstalk.com/news/gad/gad114.html</link>
    </item>
    <item>
      <title>Relieve tension using unused sockets</title>
      <description>Small cable strain relief and retention devices are suitable for a wide variety of consumer and industrial applications.</description>
      <pubDate>Mon, 05 May 2008 08:00:00 UT</pubDate>
      <category>Damage Control Products</category>
      <link>http://www.electronicstalk.com/news/dpr/dpr101.html</link>
    </item>
    <item>
      <title>Mobile filter supports eight extraction arms</title>
      <description>The MG400 filter system has a low sound level, with a maximum 55dB(A) at 1m, and so there is no noise disturbance in the working area.</description>
      <pubDate>Wed, 23 Apr 2008 08:00:00 UT</pubDate>
      <category>Link Hamson</category>
      <link>http://www.electronicstalk.com/news/lik/lik105.html</link>
    </item>
    <item>
      <title>Ceramic packages mitigate brazing stresses</title>
      <description>StratEdge's thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together. </description>
      <pubDate>Fri, 18 Apr 2008 08:00:00 UT</pubDate>
      <category>StratEdge</category>
      <link>http://www.electronicstalk.com/news/stx/stx112.html</link>
    </item>
    <item>
      <title>Spray-on coating is easy foil for ESD</title>
      <description>Crystal clear urethane coating adheres to metal, plastic and most other surfaces.</description>
      <pubDate>Fri, 18 Apr 2008 08:00:00 UT</pubDate>
      <category>Intertronics</category>
      <link>http://www.electronicstalk.com/news/ind/ind168.html</link>
    </item>
    <item>
      <title>Thin-film substrate is easier to process</title>
      <description>Novel HD alumina substrate offers straight through vias for thin-film applications.</description>
      <pubDate>Mon, 14 Apr 2008 08:00:00 UT</pubDate>
      <category>AdTech Ceramics</category>
      <link>http://www.electronicstalk.com/news/adt/adt109.html</link>
    </item>
    <item>
      <title>Manufacturing OS provides productivity boost</title>
      <description>Aegis Software's Version 7.0 Manufacturing Operations System (MOS) provides productivity-enhancing features to the manufacturing environment while providing greater operator simplicity and speed. </description>
      <pubDate>Thu, 10 Apr 2008 08:00:00 UT</pubDate>
      <category>Aegis Europe</category>
      <link>http://www.electronicstalk.com/news/aeg/aeg109.html</link>
    </item>
    <item>
      <title>Production deal secures organic substrate supplies</title>
      <description>Substrates offer a very dense, thin core, build-up flip-chip technology that combines exceptional electrical, reliability and wireability performance with a very cost effective material set.</description>
      <pubDate>Mon, 07 Apr 2008 08:00:00 UT</pubDate>
      <category>Endicott Interconnect Technologies</category>
      <link>http://www.electronicstalk.com/news/enz/enz104.html</link>
    </item>
    <item>
      <title>Water-soluble paste cleans up lead-free soldering</title>
      <description>Solder paste is billed as a breakthrough in water-soluble technology with the combination of low voiding, excellent wetting behaviour and ease of cleaning.</description>
      <pubDate>Fri, 28 Mar 2008 08:00:00 UT</pubDate>
      <category>Kester</category>
      <link>http://www.electronicstalk.com/news/kes/kes101.html</link>
    </item>
    <item>
      <title>Conformal coatings distributed in Italy</title>
      <description>Cabiotec has established a solid reputation within the Italian electronics industry, which will help to further strengthen HumiSeal's presence in the region.</description>
      <pubDate>Thu, 27 Mar 2008 08:00:00 UT</pubDate>
      <category>HumiSeal Europe</category>
      <link>http://www.electronicstalk.com/news/cnc/cnc128.html</link>
    </item>
    <item>
      <title>Ceramic substrate applications explained</title>
      <description>Guide offers electronics engineers the latest design guidelines for standard thick-film and laser machined ceramic substrates.</description>
      <pubDate>Fri, 21 Mar 2008 08:00:00 UT</pubDate>
      <category>CoorsTek</category>
      <link>http://www.electronicstalk.com/news/ckr/ckr100.html</link>
    </item>
    <item>
      <title>Flexible silicone coating passes IEC61086-2 test</title>
      <description>Samples were tested and passed for insulation resistance and breakdown voltage after the damp heat and salt mist experiments.</description>
      <pubDate>Mon, 17 Mar 2008 08:00:00 UT</pubDate>
      <category>Electrolube</category>
      <link>http://www.electronicstalk.com/news/eec/eec136.html</link>
    </item>
    <item>
      <title>Conformal coatings for Southern Africa</title>
      <description>PEM Technologies will help to further strengthen HumiSeal's presence in the region and develop its coatings business.</description>
      <pubDate>Fri, 14 Mar 2008 08:00:00 UT</pubDate>
      <category>HumiSeal Europe</category>
      <link>http://www.electronicstalk.com/news/cnc/cnc127.html</link>
    </item>
    <item>
      <title>Adhesives are specially formulated for LCDs</title>
      <description>Single-component LCD adhesives feature excellent resistance to yellowing, with increased light transmission and accurate colour rendering.</description>
      <pubDate>Wed, 12 Mar 2008 08:00:00 UT</pubDate>
      <category>Intertronics</category>
      <link>http://www.electronicstalk.com/news/ind/ind167.html</link>
    </item>
    <item>
      <title>Potting compound covers complex contours</title>
      <description>MasterSil 151 has superior electrical insulation properties, high tensile strength and superb optical clarity.</description>
      <pubDate>Wed, 12 Mar 2008 08:00:00 UT</pubDate>
      <category>Master Bond</category>
      <link>http://www.electronicstalk.com/news/mae/mae114.html</link>
    </item>
    <item>
      <title>Polymer potting agent is easy to work</title>
      <description>Can be cured in much greater section thickness than most conventional UV type systems, making it ideal for potting and encapsulation applications.</description>
      <pubDate>Tue, 11 Mar 2008 08:00:00 UT</pubDate>
      <category>Master Bond</category>
      <link>http://www.electronicstalk.com/news/mae/mae113.html</link>
    </item>
    <item>
      <title>Material improves OLED display performance</title>
      <description>New electron transport material has lower toxicity, lower voltage, higher electroluminescent efficiency, longer lifetime and lower voltage drift.</description>
      <pubDate>Mon, 03 Mar 2008 08:00:00 UT</pubDate>
      <category>OLED-T</category>
      <link>http://www.electronicstalk.com/news/ole/ole109.html</link>
    </item>
    <item>
      <title>Dispenser offers fine control of mixing</title>
      <description>The DXBG bench dispenser allows the two components of flowable adhesives to be gravity-fed from separate, refillable two-gallon containers through an integral DX dispenser. </description>
      <pubDate>Fri, 29 Feb 2008 08:00:00 UT</pubDate>
      <category>Mixpac Equipment</category>
      <link>http://www.electronicstalk.com/news/msr/msr102.html</link>
    </item>
    <item>
      <title>Pb-free paste survives under the bonnet</title>
      <description>Alpha OM-350 with InnoLot alloy has been developed to meet the growing demand for a more robust alloy that provides superior and reliable solder joints.</description>
      <pubDate>Mon, 25 Feb 2008 08:00:00 UT</pubDate>
      <category>Cookson Electronics</category>
      <link>http://www.electronicstalk.com/news/cok/cok118.html</link>
    </item>
    <item>
      <title>PU resins take the stress out of assembly</title>
      <description>Two-part polyurethane resins are supplied in universal cartridges and can be dispensed using a standard mastic gun.</description>
      <pubDate>Wed, 20 Feb 2008 08:00:00 UT</pubDate>
      <category>Rapid Electronics</category>
      <link>http://www.electronicstalk.com/news/rpi/rpi141.html</link>
    </item>
    <item>
      <title>Conductive epoxy holds on tight</title>
      <description>Silver-filled epoxy-resin system is suited for making electrically conductive connections in sensitive electronic components that are expected to withstand severe service conditions.</description>
      <pubDate>Fri, 15 Feb 2008 08:00:00 UT</pubDate>
      <category>Master Bond</category>
      <link>http://www.electronicstalk.com/news/mae/mae112.html</link>
    </item>
    <item>
      <title>Two-stage filter system goes mobile</title>
      <description>Filtronic filter captures all soldering pollutants by using the combination of a HEPA microfilter for particulates in combination with a high performance gas separation filter.</description>
      <pubDate>Fri, 15 Feb 2008 08:00:00 UT</pubDate>
      <category>Link Hamson</category>
      <link>http://www.electronicstalk.com/news/lik/lik103.html</link>
    </item>
    <item>
      <title>PCB laminate is made for high-power LEDs</title>
      <description>Environmentally friendly laminate is designed to keep bright and ultrabright LED light engines burning brighter, longer and uniformly.</description>
      <pubDate>Wed, 13 Feb 2008 08:00:00 UT</pubDate>
      <category>Laird Technologies</category>
      <link>http://www.electronicstalk.com/news/lir/lir145.html</link>
    </item>
    <item>
      <title>Lead-free solder wire is kind to tips</title>
      <description>No-clean cored solder wire is developed for manufacturers who do not require silver in lead-free materials.</description>
      <pubDate>Fri, 08 Feb 2008 08:00:00 UT</pubDate>
      <category>Almit Technology</category>
      <link>http://www.electronicstalk.com/news/alm/alm111.html</link>
    </item>
    <item>
      <title>Conductive elastomer improves in-car multimedia</title>
      <description>Using its Cho-Seal 1285 conductive elastomer, Chomerics designed a custom extrusion that improved the performance of a rear windscreen antenna receiver unit.</description>
      <pubDate>Thu, 07 Feb 2008 08:00:00 UT</pubDate>
      <category>Chomerics Europe</category>
      <link>http://www.electronicstalk.com/news/cho/cho147.html</link>
    </item>
    <item>
      <title>Small-run metal parts produced fast</title>
      <description>Refined to the highest levels to rapidly deliver burr and stress free custom solutions, Tecan offers a 48hr turnaround service for photo-chemical machined (PCM) or 'photo-etched' metal parts.</description>
      <pubDate>Fri, 18 Jan 2008 08:00:00 UT</pubDate>
      <category>Tecan</category>
      <link>http://www.electronicstalk.com/news/tea/tea177.html</link>
    </item>
    <item>
      <title>Silver-filled epoxy for flexible conductive bonds</title>
      <description>The flexibility of Elecolit 3653 makes it ideal for applications that are subject to vibration or rapid temperature changes, thermal shock, twisting or buckling.</description>
      <pubDate>Wed, 16 Jan 2008 08:00:00 UT</pubDate>
      <category>Eurobond Adhesives</category>
      <link>http://www.electronicstalk.com/news/eun/eun100.html</link>
    </item>
    <item>
      <title>Medical swabs are safe for electronics</title>
      <description>Swabs feature ESD-safe polypropylene handles, and include dissipative foam and ultraclean microfibre-tipped applicators.</description>
      <pubDate>Mon, 31 Dec 2007 08:00:00 UT</pubDate>
      <category>Puritan Medical Products</category>
      <link>http://www.electronicstalk.com/news/pui/pui100.html</link>
    </item>
    <item>
      <title>Potting compound is key to protection</title>
      <description>Two-comportment silicone elastomer solution enables a new technology to protect mission-critical electronic components from damage due to heat, shock and vibration.</description>
      <pubDate>Wed, 12 Dec 2007 08:00:00 UT</pubDate>
      <category>Lord Corporation</category>
      <link>http://www.electronicstalk.com/news/lod/lod104.html</link>
    </item>
    <item>
      <title>Guide explains injection moulded ceramics</title>
      <description>Capabilities include metallisation with refractory metal or platinum conductors, nickel and gold plating as required, and ceramic material options.</description>
      <pubDate>Thu, 22 Nov 2007 08:00:00 UT</pubDate>
      <category>AdTech Ceramics</category>
      <link>http://www.electronicstalk.com/news/adt/adt108.html</link>
    </item>
    <item>
      <title>Help with problems of tin whiskers</title>
      <description>Aerco has increased its stock holdings of difficult-to-source nonRoHS-compliant components and is also helping its customers to source alternatives to tin such as gold.</description>
      <pubDate>Wed, 21 Nov 2007 08:00:00 UT</pubDate>
      <category>Aerco</category>
      <link>http://www.electronicstalk.com/news/aea/aea256.html</link>
    </item>
    <item>
      <title>Display film boosts LCD brightness</title>
      <description>LCD TVs with DBEF show an increase in backlight efficiency of between 30% to 50% and an increase in TV efficiency of 20% to 30%.</description>
      <pubDate>Tue, 13 Nov 2007 08:00:00 UT</pubDate>
      <category>3M Digital Signage</category>
      <link>http://www.electronicstalk.com/news/mdi/mdi110.html</link>
    </item>
    <item>
      <title>Military technology provides moisture protection</title>
      <description>Ion-mask enhancement provides manufacturers with a 21st century solution to waterproofing electrical items and componentry. </description>
      <pubDate>Thu, 08 Nov 2007 08:00:00 UT</pubDate>
      <category>P2i</category>
      <link>http://www.electronicstalk.com/news/pif/pif100.html</link>
    </item>
    <item>
      <title>Flexible silicone coating to launch in Munich</title>
      <description>Fast-drying silicone-based conformal coating is designed to protect printed circuit boards exposed to high humidity environments.</description>
      <pubDate>Mon, 05 Nov 2007 08:00:00 UT</pubDate>
      <category>Electrolube</category>
      <link>http://www.electronicstalk.com/news/eec/eec135.html</link>
    </item>
    <item>
      <title>Alcohol wipes improve adhesive bonds</title>
      <description>ADH1610 wipes are suitable for the removal of fluxes, light oils, polar soils, dirt, inks and oxides</description>
      <pubDate>Fri, 02 Nov 2007 08:00:00 UT</pubDate>
      <category>Intertronics</category>
      <link>http://www.electronicstalk.com/news/ind/ind166.html</link>
    </item>
    <item>
      <title>Placement system provides speed and reliability</title>
      <description>High-speed image processing software provides a 100 % quality check of BGA and fine pitch components prior to placement. </description>
      <pubDate>Thu, 01 Nov 2007 08:00:00 UT</pubDate>
      <category>Contax</category>
      <link>http://www.electronicstalk.com/news/cnt/cnt192.html</link>
    </item>
    <item>
      <title>System doubles printing output</title>
      <description>DEK's new solution delivers full in-line production at high speed, while occupying a significantly reduced line footprint. </description>
      <pubDate>Wed, 31 Oct 2007 08:00:00 UT</pubDate>
      <category>DEK</category>
      <link>http://www.electronicstalk.com/news/dek/dek273.html</link>
    </item>
    <item>
      <title>Programme develops barriers</title>
      <description>The Systems-in-Foil programme develops advanced polymeric materials for use in innovative barrier structures. </description>
      <pubDate>Thu, 25 Oct 2007 08:00:00 UT</pubDate>
      <category>Huntsman Advanced Materials</category>
      <link>http://www.electronicstalk.com/news/hut/hut107.html</link>
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