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PCB Assembly Equipment and Tools

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Single soldering stations stand alone

Each member of the new "singles" family of JBC soldering stations works with a dedicated tool and combines all the necessary functions into a single benchtop unit.  Brochure available  

News from Kaisertech ( 9 May 2008)

Assembly line smoothes PCB production

 User application article   Contax has installed a new PCB assembly line for OEM Gemini 2000.

News from Contax (25 April 2008)

Soldering and rework system doubles productivity

High-power flexible system for production hand soldering, touch-up and SMD rework incorporates the ability to operate one or two different handpieces at the same time.  Brochure available  

News from OK International (17 April 2008)

Laser wire stripper answers mil/aero demands

Novel rotary beam delivery system ensures a cleaner cut all around the circumference of the cable, as opposed to just along the top and the bottom as in previous machines.

News from Spectrum Technologies (11 April 2008)

Coating systems go on show

National Electronics Week will be an opportunity for electronics companies to attend a drop-in coating problem workshop in which SCH will help solve any coating issues.

News from SCH Technologies ( 7 April 2008)

Surface mount platform provides speed and accuracy

The AdvantisX lineup includes single and dual-gantry high-speed models with Lightning Head technology.

News from Universal Instruments (31 March 2008)

Printing system upgrades materials deposition

Enclosed head printing provides exceptionally efficient materials transfer, superior throughput rates, higher process yields, lower material consumption and improved process control.

News from DEK (31 March 2008)

Assembly systems business to stand alone

Siemens reckons its Electronics Assembly Systems business unit will be able to operate more flexibly and with even more customer orientation as an independent unit.

News from Siemens A&D Electronics Assembly Systems (28 March 2008)

Plasma etching system is the real thing

Cost-engineered etching system is designed to appeal to price-conscious Asian-based PCB manufacturers.

News from Plasma Etch (27 March 2008)

Preheater delivers more heat to difficult boards

Ideal for high thermal demand applications such as lead-free, multilayer boards and large ground planes, the PCT-1000 improves process efficiency and control.  Brochure available  

News from OK International (27 March 2008)

Budget stencil printer uses top-line technology

Includes new, patent-pending, transport and squeegee systems along with a vacuum stencil wiper and patented roller solvent bar delivery system.

News from Contax (27 March 2008)

Print platform handles large image sizes

The Europa Vi can handle large board products up to 7.5kg in weight and 6mm thick and features heavy-duty remote board stops.

News from DEK (25 March 2008)

Software offers speedy verification

HawkEye operates at the line beat rate, delivering a go/no-go indication for each board and isolating faulty boards in real-time.

News from DEK (20 March 2008)

New US sales channel for drying cabinets

A new company, Totech Universal, replaces Totech America which no longer sells authorised Totech products.

News from Totech Europe (17 March 2008)

Placement platform speeds electronics assembly

 User application article   The Genesis GC-120Q delivers delivers high-speed placement across a broad range of components.

News from Universal Instruments (17 March 2008)

Pick and place machines meet software

Enhanced machine interfaces are now available for vPlan - Valor's advanced process engineering tool - on Assembleon's A-Series, M-Series and X-Series machines.

News from Assembléon (14 March 2008)

Soldering machine offers fine temperature control

Using the new temperature profile control software, up to 20 temperature set values can be stored per profile and four independent profiles can be saved on the VP 400.

News from Contax (13 March 2008)

Microconnection businesses are united

Miyachi, Miyachi Peco, Miyachi Unitek and Unitek Eapro ranges come together under the Miyachi Europe banner.

News from Miyachi Europe Corporation (11 March 2008)

IR handtool focuses on BGA rework

System is tip/nozzle free, gas free, instantly/precisely controllable, clean and produces high quality BGA rework without any complications.

News from PDR SMT/BGA Rework Solutions (25 February 2008)

SMT platform philosophy spawns solar cells

DEK has developed a new range of highly modular PV cell manufacturing solutions to accommodate the demanding needs of the industry going forward.

News from DEK (19 February 2008)

Aqueous cleaners keep it green

Systems are fully self-contained: the cleaning and rinse fluids are recirculated through fine filters, which capture any contaminates.

News from Contax (18 February 2008)

Acquisition expands SMT support

Merger will now bring around 15 new product families to Gen3 Systems for exclusive distribution within the UK and Ireland.

News from Gen3 Systems ( 7 February 2008)

Cut and strip machines automate measurements

Komax Kappa 330 benchtop cut and strip machines perform all the wire outside diameter and inside conductor diameter measuring automatically, offering very rapid setup and changeover.

News from Contax (24 January 2008)

Platform streamlines screen printing

 User application article   The Horizon 03i comes equipped with DEK's Instictiv user interface and the ISCAN control network, which supports a faster, lighter and more reliable bus system.

News from DEK (18 January 2008)

Multimillion Euro display deal signed

The production of flexible displays requires the ability to support flexible substrates, such as plastic, which lack the mechanical and thermal stability typically afforded by glass substrates.

News from EV Group (17 January 2008)

Pick and place system boosts capacity

Essemtec's new SMD pick and place machine allows faster loading/unloading of PCBs compared to systems without a conveyor.

News from Essemtec ( 9 January 2008)

Soldering system has the power to save energy

Fixed temperature system varies power to match the thermal demand of the device being soldered.  Brochure available  

News from OK International (17 December 2007)

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