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PCB Assembly Equipment and Tools
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Inline printer puts BGA bumps on 300mm wafers
Ekra has released the X5-WAF, a new inline wafer bumping system.
News from Ekra (15 November 2001)
Large-format inline stencil printer
With a print area of 36 x 24in, the E5-36 from Ekra offers the largest board size capability available today in an inline fully automatic printer.
News from Ekra (14 November 2001)
Greener solvent proves more effective
User application article PCB assembler Electronic Technicians Ltd has seen an improvement in cleaning quality and a reduction in reject rates after the installation of a cosolvent cleaning system from Kerry Ultrasonics. Brochure available
News from Kerry Ultrasonics (13 November 2001)
Component press-in machine makes new sense
The new CPM Prestige from Harting is a semiautomatic component press-in machine combining short cycle times, advanced sensing technology and an easy-to-use graphics interface.
News from Harting ( 7 November 2001)
Two heads are better than one for flip chip bonder
The PESL DB5-TSV vertical-head ultrasonic flip chip bonder can be rapidly converted to horizontal ultrasonics and can be used as a highly accurate pick and place machine.
News from Production Equipment Sales (30 October 2001)
Don't just take DEK's word for it
DEK's message to the electronics market throughout 2001 has been that its enthusiastic and creative attitude results in the achievement of real business objectives for customers.
News from DEK (18 October 2001)
Smart route to lead-free hand soldering
Technical background article Switching to lead-free hand soldering need not demand new soldering equipment or processes thanks to an established iron technology from Metcal.
News from Metcal (17 October 2001)
Enclosed head printing gains support worldwide
User application article Enclosed-head screen printing was introduced to the electronics assembly industry in 1997, and aimed to reduce materials wastage, minimise operator intervention and tighten process control.
News from DEK ( 9 October 2001)
Press-fit technology improves throughput
User application article Sanmina Dublin, the leading contract manufacturer to the electronics manufacturing services market, has invested in advanced servoelectric press-fit technology from ASG, part of Tyco Electronics.
News from Tyco Electronics - Global Application Tooling ( 9 October 2001)
Improved printing on show in Munich
The latest additions to DEK's ProFlow product family will break cover at Productronica this November.
News from DEK ( 5 October 2001)
Printers improve their image
DEK has upgraded its ProFlow DirEKt imaging system to enhance its effectiveness and applications.
News from DEK ( 4 October 2001)
Production equipment goes online
Electronic production equipment specialist Kaisertech has opened its online shop at www.kaisertech.co.uk.
News from Kaisertech ( 2 October 2001)
Programmable baths clean consistently
Kerry has developed bench-top ultrasonic cleaning baths which can be programmed to maximise the quality and repeatability of results. Brochure available
News from Kerry Ultrasonics ( 2 October 2001)
Semiautomatic component press-in machine on show
At Productronica Harting is featuring the latest developments in its range of component press-in machinery.
News from Harting (26 September 2001)
Three-piece lead reconditioning system
PESL now offers a viable solution to bent, misaligned or mangled leads, with a manually operated three-piece lead reconditioning system from Fancort.
News from Production Equipment Sales (21 September 2001)
Stripper speeds crimping process
A new development from Tyco Electronics represents a significant step forward in crimp press technology.
News from Tyco Electronics - Global Application Tooling (21 September 2001)
Splicers claim faster and easier operation
Furukawa Electric Europe is claiming a world-leading breakthrough in the speed and ease of use of optical-fibre splicing technology, to be unveiled at next month's ECOC show in Amsterdam.
News from Furukawa Electric Europe (12 September 2001)
Hot bar bonder tackles many tasks
Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF bonding
News from Kaisertech ( 5 September 2001)
Robot dispenses with liquids and pastes
The new I and J Fisnar I and J2400 dispensing robot from Intertronics dispenses liquids and pastes in dots, lines or arcs.
News from Intertronics (20 August 2001)
Rework system provides even heating
The Sniper-WB, available from Kaisertech, has been developed to rework PCBs as small as 51 x 51mm right up to 508 x 610mm, and even larger boards can be accommodated by special request.
News from Kaisertech (17 July 2001)
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