PCB Assembly Equipment and Tools

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Pump goes beyond the pail

The Fisnar 560092A manual pail pump provides an inexpensive solution to the problem of extracting bulk viscous materials from 19 litre straight-sided cans.

News from Intertronics (25 December 2002)

Local accolade for DEK

Weymouth-based DEK has received the Business In The Community Award, part of the Dorset Business Awards 2002.

News from DEK (23 December 2002)

Applying adhesives accurately at speed

Technical background article As placement systems begin to process up to 80,000 components an hour, it's important to rethink other SMT assembly processes - especially the bottleneck of dispensing adhesives, says Mike O'Hanlon.

News from DEK (16 December 2002)

Programmable UV source is a flexible cure

A novel programmable feedback UV light source maintains extremely stable UV irradiation from a quartz halogen lamp through proprietary optical feedback control.

News from Moritex Europe (16 December 2002)

SMT materials are match for printers

Ekra and the Circuit Material Division of WC Heraeus have signed a agreement under which EKRA will recommend the use of Heraeus SMT materials with its range of printers.

News from Ekra (12 December 2002)

System cleans screens even more effectively

The Vortex Plus under-screen cleaning system from DEK now cleans screens even more effectively in a single pass, through use of a new two-dimensional cleaning action.

News from DEK (11 December 2002)

Software makes the most of placement machine

Universal Instruments has complemented the latest hardware enhancements to its GSM placement platform with new UPS+ control software.

News from Universal Instruments Corp (10 December 2002)

Handy needle-valve dispensing pen

The I and J Fisnar JC1015 is a convenient and lightweight dispensing tool which operates by pressing a finger-switch to actuate a needle valve.

News from Intertronics ( 6 December 2002)

Irvine takes on complete SMT line

User application article Universal Instruments has installed a complete line solution for Irvine Electronics.

News from Universal Instruments Corp ( 5 December 2002)

Sharma takes charge of information

DEK has appointed Pamal Sharma as Chief Information Officer.

News from DEK ( 2 December 2002)

Placement alliance survives acquisition

Hitachi High-Technologies and Universal Instruments are to continue their successful OEM business for turret-style high-speed placement equipment.

News from Universal Instruments Corp ( 2 December 2002)

Inline technology aids wafer-level processing

Technical background article Neil MacRaild of DEK explains how back-end packaging processes and technology must become more flexible for manufacturers to produce today's advanced packages at commercial prices.

News from DEK (27 November 2002)

Repair kit gets PCBs back in shape

A handy new kit from Intertronics contains virtually everything needed to repair most types of damage to assembled or bare printed circuit boards.

News from Intertronics (27 November 2002)

Mass measurement is front-line inspection process

A novel solder paste inspection system aims to provide paste inspection on 100% of every board with no programming requirements, negligible setup time and no impact on throughput.

News from DEK (26 November 2002)

IC packaging and board assembly converge

Technical background article Only dynamic organisations will be able to work with, rather than against, the convergence of back-end component packaging and front-end assembly, argues Richard Heimsch of DEK International.

News from DEK (25 November 2002)

System prepares samples for SEM and TEM

An automatic polisher that offers rapid sample preparation for SEM and TEM inspection in one tool has been introduced in Europe by Alliance Sales (Europe).