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PCB Assembly Equipment and Tools

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Interface keeps printers up and running

DEK has worked with human factors experts at Georgia Tech to create an ergonomically superior user interface that simplifies machine setup, monitoring and troubleshooting.

News from DEK (31 March 2003)

Dispensing system shows its versatility

See-Flo 7 is a versatile meter/mix/dispense system that precisely dispenses pourable, two-component reactive resins.

News from Sealant Equipment and Engineering (28 March 2003)

Medium-wavelength IR for gentle rework

Blundell Production Equipment is challenging any company to find a device that cannot be removed and replaced safely using its Ersa IR500A rework station.

News from Blundell Production Equipment (25 March 2003)

Easy upgrade for legacy through-hole lines

The new line of CE-compliant Generation 8 axial and radial inserters offers manual loading, in addition to greater throughput and reliability.

News from Universal Instruments Corp (25 March 2003)

UK order for advanced component mounters

Assembleon has received an order from Renishaw for two ACM advanced component mounters for installation on production lines in Gloucestershire, UK.

News from Assembléon (24 March 2003)

Green clean up in Brighton

Kerry Ultrasonics will show low-solvent-consumption Microsolve cleaning systems and the Microclean aqueous range alongside other new products at Nepcon 2003.  Brochure available  

News from Kerry Ultrasonics (24 March 2003)

Budget price for photonics alignment system

The TWS-1000 photonics alignment system is ideal for R and D and low-volume production as well as teaching institutions that require state-of-the-art equipment at a reasonable price.

News from EXFO Electro-Optical Engineering (19 March 2003)

Light curing system hits the spot

EXFO Lite is an ultraviolet/visible spot-curing system for manual precision-assembly environments.

News from EXFO Electro-Optical Engineering (19 March 2003)

Cosolvent cleaning meets military specs

 User application article   A cosolvent cleaning system is saving PCB manufacturer Ultra Electronics over GBP 45,000 a year, while boosting productivity and consistently satisfying highly stringent standards of cleanliness.  Brochure available  

News from Kerry Ultrasonics (18 March 2003)

Process fills vias faster than squeegees

Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.

News from DEK (12 March 2003)

Speedy upgrade for fusion splicers

Furukawa Electric has a new compact optical fibre fusion splicer that partially upgrades the Fitel S199 series of optical fibre fusion splicers.

News from Furukawa Electric (12 March 2003)

Placement for small- to mid-size manufacturers

Vantis is an accurate and reliable placement platform introduced to meet the needs of small- to mid-size consumer electronics, audio-visual equipment, PC and peripheral manufacturers.

News from Universal Instruments Corp (10 March 2003)

Fume extractors banish nasty soldering niffs

Kaisertech is now a distributor for the Bofa range of fume extraction equipment, enabling the company to offer a wider range of fume extraction solutions and systems.  Brochure available  

News from Kaisertech ( 6 March 2003)

Bargain combo for soldering and rework

Anyone buying a Metcal MX-500 soldering, desoldering and rework system in the UK can purchase the system's Talon tweezers, complete with a pair of TATC-601 tips for just GBP 1.

News from Metcal ( 4 March 2003)

No chlorine needed for high-performance PCB washer

The 1300PCB washer and dryer is designed for cleaning printed circuit boards in critical environments of the electronics industry.  Brochure available  

News from Lancer UK ( 3 March 2003)

Benchtop unit provides fast flexible assembly

Tyco Electronics has developed an advanced automatic insertion machine it claims delivers superb levels of speed, flexibility and functionality.  Brochure available  

News from Tyco Electronics - Global Application Tooling ( 3 March 2003)

Automatic placement for novel plastic shield

DEK has combined with WL Gore and Associates to deliver a lightweight, easily removable EMI board-level shield for wireless communications devices.

News from DEK (25 February 2003)

Tool gets to grips with cable ties

Panduit has extended its family of hand-operated cable-tie installation tools with the addition of the new lightweight and ergonomic GTH tool.

News from Panduit (25 February 2003)

Website carries Chipshooter software upgrades

Universal Instruments has added software support services for its HSP (chipshooter) products to its website.

News from Universal Instruments Corp (25 February 2003)

Faster furnaces produce better solar cells

ASA has a new photovoltaic furnace from RTC that it reckons can produce higher efficiency and lower cost solar cells.

News from Advanced Systems Automation (Europe) (18 February 2003)

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