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PCB Assembly Equipment and Tools
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Reflow oven is economical to run
Available now from Contax, the Electrovert OmniExcel 7 reflow oven is ideally suited to high-density board applications and offers outstanding cost savings when compared with similar systems.
News from Contax (26 August 2004)
Lightning performance goes on show
Universal Instruments is showing its fastest AdVantis platform based placement machine at Globaltronics next month.
News from Universal Instruments Corp (26 August 2004)
Convection reflow ovens are ready for lead-free
The Dima range of convection reflow ovens features lead-free capability to meet future electronics industry needs in view of the forthcoming lead ban. Brochure available
News from Kaisertech (18 August 2004)
Bookham signs up for further fusion splicers
Bookham Technology has purchased additional Vytran FAS systems to expand its automated EDFA production capabilities.
News from Vytran Corp (18 August 2004)
Preplacement platform claims the lead
DEK reckons its flagship machine for advanced SMT preplacement delivers the next level of speed, accuracy, repeatability and productivity.
News from DEK (17 August 2004)
Organisational changes provide divisional autonomy
IPTE has made a number of organisational changes which will allow its Factory Automation and Contract Manufacturing Divisions to each follow a more autonomous course.
News from IPTE (11 August 2004)
Licence provides second source for stencils
DEK has licensed its VectorGuard stencil technology to Christian Koenen of Munich, Germany.
News from DEK ( 4 August 2004)
Pair to refine novel filling process
Rohm and Haas Electronic Materials and Novatec have signed an exclusive licensing agreement to make and sell an innovative filling process and device.
News from Novatec ( 3 August 2004)
Reflow ovens break new ground
A new generation of Quattro Peak ovens for medium through very high volume applications includes many novel features, which until now have not been available in a reflow oven.
News from Inseto (30 July 2004)
Chicago showing for top-speed platform
Universal Instruments will show off its fastest platform based placement machine at ATExpo in Chicago this September.
News from Universal Instruments Corp (28 July 2004)
Mass imaging platform runs backside wafer coating
A new high throughput backside wafer coating process is capable of exceeding the +/-12.5mm total thickness variation stipulated by most wafer processing specialists.
News from DEK (27 July 2004)
Business booms in fume extraction
To increase sales and offer more support for growing markets, Purex International, manufacturer of laser and solder fume extraction systems has recruited additional staff.
News from Purex International (27 July 2004)
deSouza takes the helm
Universal Instruments Corp has announced a change at the top of its management structure.
News from Universal Instruments Corp (27 July 2004)
New agreement reinforces partnership
Yamaha IM and Assembleon have renewed their co-operation contract which perpetuates a 17-year partnership in the global SMD placement market.
News from Assembléon (22 July 2004)
New line aims for zero-defect production
User application article Contax has been chosen by a leader in the manufacture of automotive assemblies to develop and install automated assembly lines for its next generation electronic power assisted steering systems.
News from Contax (21 July 2004)
Distributor reigns in Spain
Universal Instruments has appointed Madrid-based Asflex Internacional to support its sales operations in Spain.
News from Universal Instruments Corp (21 July 2004)
Quick start for high-power UV curing head
A new 70mm high power UV curing head is suitable for adhesive, inkjet and small print UV cure applications.
News from Jenton International (19 July 2004)
Tooling system provides firm support
Transition Automation's Board-Lok dedicated tooling systems are designed for double-sided printing, providing firm support customised for any board design.
News from Transition Automation (16 July 2004)
Quad-beam system speeds high-volume placement
Universal Instruments is bolstering its high-speed chip placement offering with the introduction of the Quadris placement machine.
News from Universal Instruments Corp (16 July 2004)
3D laser scanner checks paste and placement
The GSI Lumonics SVST 8300 SPI automated optical inspection system is optimised for high-throughput pre- and post-solder paste inspection of PCB assemblies.
News from Alliance Sales (Europe) (15 July 2004)
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