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PCB Assembly Equipment and Tools
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Crimping tool addresses "big three" criteria
Technical background article At its core, the process of crimping electrical connectors is not complicated: however, the same cannot be said about the process of choosing a crimping tool, says Robert Poirier.
News from FCI-Burndy (12 August 2005)
Handheld printer is flexible about identification
The T107M printer is a heavy-duty tool that combines an affordable, easy to use, ruggedised handheld thermal transfer printer with labels and heat shrink tubing developed for tough applications. Brochure available
News from Tyco Electronics UK (11 August 2005)
Advanced line speeds through flip-chip assembly
Universal Instruments has designed an advanced assembly line that can assemble over 2000 flip chips per hour on flexible circuits.
News from Universal Instruments Corp (11 August 2005)
Assembly cells to the fore at ATExpo
Universal Instruments will highlight its Polaris and Polaris Junior assembly cells at ATExpo 2005.
News from Universal Instruments Corp (10 August 2005)
Kit offers quick route to fibre termination
The Xpress termination kit offers fast and reliable LC, SC and ST connector terminations for optical local area networks.
News from Molex UK (10 August 2005)
New boss for Asia Pacific organisation
Assembleon Asia Pacific has appointed Goh Kee Tuan as Vice President/General Manager.
News from Assembléon ( 8 August 2005)
Italian distributor expands portfolio
Universal Instruments and Selettra have extended their distribution partnership in the Italian electronics market.
News from Universal Instruments Corp ( 8 August 2005)
Award for precision coating system
At the Semicon West Show in July Ultrasonic Systems was awarded the SST Attendees' Choice Award for "Best cost of ownership".
News from Ultrasonic Systems ( 2 August 2005)
Imaging platform turns to backside wafer coating
Long recognized as the world leader in high accuracy mass imaging technology, DEK has led the way with yet another cost-effective packaging solution.
News from DEK ( 1 August 2005)
Precise coating application on show in Chicago
Ultrasonic Systems will display the Prism Ultra-Coat System at the Assembly Technology Expo from 27th to 29th September 2005 in Chicago.
News from Ultrasonic Systems (26 July 2005)
Die handling system cuts production bottleneck
A novel fully automated handling system picks die from diced 300mm wafers and transfers them to die carriers, such as waffle packs, GelPaks etc.
News from Royce Instruments (25 July 2005)
Mass imaging platform scoops magazine award
In a ceremony at last week's Semicon West exhibition in San Francisco, California, DEK's Galaxy high accuracy mass imaging platform collected Advanced Packaging magazine's prestigious AP Award.
News from DEK (21 July 2005)
Kan spearheads Asian expansion
Universal Instruments Corp has appointed Eric Kan to the position of Vice President for Asia, enhancing the company's commitment to this major growth area.
News from Universal Instruments Corp (20 July 2005)
Stencil printers go both ways for Kostal
User application article Kostal Ireland has purchased eight MPM UP3000 UltraFlex stencil printers from Irish-based Contax Production Automation.
News from Contax (19 July 2005)
Tool speeds connector installation
A ratchet-based crimp tool aims to speed the installation of the Han range of industrial connectors.
News from Harting (15 July 2005)
Mass imaging turns to ball placement
DEK has developed breakthrough wafer bumping and ball placement solutions for today's most demanding packaging applications.
News from DEK (15 July 2005)
Microprocessors assembled at lightning speed
User application article Universal Instruments has designed a line that can assemble 2000 microprocessors per hour - approximately 60 to 80% faster than existing lines.
News from Universal Instruments Corp (13 July 2005)
Expansion for Americas distributor network
Continuing its commitment to provide easy access to DEK consumables, the company has expanded its Americas distributor network.
News from DEK (12 July 2005)
Enclosed print head aids switch to Pb-free
Enclosed print head technology from DEK delivers optimal lead-free mass imaging performance in a time of dramatic change for the global electronics manufacturing industry.
News from DEK (11 July 2005)
Software puts pick and place to the fore
Dima SMT Systems has developed a software package of a type so far only available from a few suppliers of high end pick and place machines.
News from Dima SMT Systems NL (11 July 2005)
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