PCB Assembly Equipment, Tools

(a sub category of Electronics Manufacturing, Packaging)

A - Z list of suppliers

Click on a letter below to find a supplier...

A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
R
S
T
U
V
W
Y
All suppliers

Latest articles from 'PCB Assembly Equipment, Tools'

News releases from this sub-category

Showing 851-875 of 1115 articles

first
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
next

Screen printer network expands globally

Reprint Services and Reprint have appointed four more distributors, increasing their joint sales network in Europe and South America.

News from Reprint Services, Aug 8, 2003

Cost reduction leads to price cuts

Universal Instruments Corp has embarked on a global cost reduction initiative designed to set new product pricing standards in the assembly industry.

News from Universal Instruments Corp, Aug 4, 2003

Grime aims to clean up in new role

Kerry Ultrasonics has appointed David Grime as its new Managing Director.

News from Kerry Ultrasonics, Jul 31, 2003

Bonding heads speed soldering operations

A new family of air-actuated heads is specially designed to address pulsed heated hot bar reflow soldering applications.

News from Townsend Coates, Jul 30, 2003

More options for printer tooling

DEK has expanded its range of advanced tooling options through a joint sales and marketing agreement with Ovation Products.

News from DEK, Jul 25, 2003

Research to focus on lead-free processes

Universal Instruments and the University of Maryland are to co-operate on research projects into reliability and manufacturability in packaging and assembly.

News from Universal Instruments Corp, Jul 24, 2003

Spotlight provides an economical cure

Low cost of ownership and high efficiency are the hallmarks of the new BlueWave 50 UV spot curing system.

News from Dymax, Jul 18, 2003

Competitive pricing for placement kit

Kaisertech, Assembleon's UK agent, can now supply the new competitively priced Opal-XII surface mount component placement unit.

News from Kaisertech, Jul 17, 2003

Rework system expands to handle bigger boards

The APR-5000-XLS array package rework system uses a single reflow/placement head and a stationery PCB centred over an enhanced, dual-zone pre-heater capable of handling both large and small boards.

News from Metcal, Jul 15, 2003

System automates conformal coating for PCBs

The PVA 750 is a programmable spray coating machine primarily designed for applying conformal coatings to printed circuits.

News from Blundell Production Equipment, Jul 11, 2003

Web-based tool calculates return on investment

A new ROI calculator enables potential and current users of DEK's award-winning ProFlow paste deposition process to put a financial value on the benefits of implementing the system.

News from DEK, Jul 8, 2003

Budget pricing for full SMT line

Blundell Production Equipment can now supply a very competitively priced surface mount assembly line for less GBP 50,000.

News from Blundell Production Equipment, Jul 1, 2003

Website focuses on local solutions

Panduit has relaunched its new-look pan-European website.

News from Panduit, Jul 1, 2003

Industry focus for Marca and Stanton

In response to expanding business, Universal Instruments has created the new position of Industry Segment Account Manager to focus on growing markets within specific industries.

News from Universal Instruments Corp, Jul 1, 2003

Pair to link manufacturing software

Universal Instruments and Valor Computerised Systems have announced an agreement to interface Valor software products with Universal's manufacturing systems.

News from Universal Instruments Corp, Jun 26, 2003

Pair to provide flip chip assembly process

DEK and PacTech USA have formed a technology partnership that leverages the strengths of the two companies for high-volume, high-speed wafer processing and bumping solutions.

News from DEK, Jun 18, 2003

Lamanna moves up to global role

Universal Instruments has appointed Bob Lamanna as Director, Global Services.

News from Universal Instruments Corp, Jun 18, 2003

Technology roadshow proves successful

On Tuesday 20th and Thursday 22nd May electronics manufacturers, industry experts, and Universal personnel met in Fremont for two days of information sharing on a wide range of topics.

News from Universal Instruments Corp, Jun 16, 2003

Desktop systems provide flexible bonding

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

News from Unitek Eapro, Jun 11, 2003

Tape reduces wafer waste

A new range of wafer dicing tapes designed to assure consistent, precise and repeatable wafer production yields has been introduced to Europe by Alliance Sales (Europe).

News from Alliance Sales (Europe), Jun 6, 2003

Cleaning systems gain handling solution

Kerry Ultrasonics has developed a new automated work transporter for its Microsolve solvent cleaning systems.

News from Kerry Ultrasonics, Jun 5, 2003

Rental contracts ease production expansion

Originally devised to answer demand for investment aid in the electronics assembly sector in Germany, Ekra has extended its novel finance service to the whole of Europe.

News from Ekra, Jun 3, 2003

Irons meet stringent requirements

Park Air Systems, a dominant company in the air traffic control equipment market, has specified JBC soldering equipment following extensive evaluation.

News from Kaisertech, Jun 3, 2003

Screen printer aims for solar-cell production

The X5 Solar inline screen printer is especially suited for solar cell and/or hybrid production, with very high throughput rates where high precision at maximum speed is a must.

News from Ekra, Jun 2, 2003

Printer claims precision, speed and flexibility

The X3 is a fully automatic high-performance inline printer claimed to set new standards in cost-efficient manufacturing and maintainability.