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PCB Assembly Equipment and Tools
Archive page 12 of 49
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Automatic crimping machine proves popular
User application article Contax has installed a second Komax Gamma 333PC automatic crimping machine at Elite Electronics, Northern Ireland's leading contract electronics manufacturer.
News from Contax (19 April 2006)
Noise suppressor improves high-speed signal lines
Noise suppressor to find application in Serial ATA, USB2.0 and IEEE1394 connections.
News from Panasonic Industrial Europe (18 April 2006)
Focused infra-red simplifies lead-free BGA rework
Technical background article Some of the world's top OEMs and EMS providers rely on focused infra-red technology to simplify one of electronics manufacturing's riskiest, most demanding and unavoidable tasks.
News from PDR SMT/BGA Rework Solutions (14 April 2006)
Imaging technology scoops Asian innovation award
DEK has won the award for best entry in the dispensing systems/equipment category at the Electronics Manufacturing Asia Innovation Awards 2006.
News from DEK (11 April 2006)
Low-cost welders offer lead-free bond alternative
MacGregor Welding Systems will be launching a new range of low cost entry level welding machines at this year's Nepcon show.
News from MacGregor Welding Systems ( 7 April 2006)
Soldering tips stand up to lead-free processing
Plato soldering tips are constructed from highly conductive premium grade copper to transmit heat to the work more quickly than other brands.
News from Intertronics ( 6 April 2006)
Printer and dispenser share lead-free experience
Contax will be exhibiting in conjunction with Speedline Technologies to display two products at the SMART Lead Free Experience centre at Nepcon UK 2006.
News from Contax ( 6 April 2006)
Pick and place partnership set to continue
Assembleon and Yamaha IM are extending their strategic pick and place partnership for another three years.
News from Assembléon ( 5 April 2006)
Upgrade accelerates pick and place performance
A Speedpack upgrade for the AX range of pick and place machines increases the output of SMD placement equipment lines by up to 15%, while also improving line balancing.
News from Assembléon ( 5 April 2006)
Process innovations on show in Germany
DEK will exhibit its latest product and process innovations at this year's SMT/Hybrid/Packaging exhibition from 30th May to 1st June at Nuremberg in Germany.
News from DEK ( 3 April 2006)
Extra line boosts surface mount throughput
User application article Contax has supplied and installed a third surface mount assembly line for electronic board manufacturer In-Line Electronics.
News from Contax ( 3 April 2006)
Placement platforms demonstrated in Nuremberg
Universal Instruments is showing two AdVantis placement platform models on Booth 7-449 at SMT Nuremberg (19th to 21st April 2006).
News from Universal Instruments Corp (28 March 2006)
Actuators upgrade pick-and-place operations
Moving coil actuators are available to upgrade pneumatic and electrical pick and place heads in electronics manufacturing, with direct replacements available in some cases.
News from Orlin Technologies (27 March 2006)
Packaging process protects components from reflow
A novel packaging technique allows temperature-sensitive components to be surface mounted by reflow soldering, despite their sensitivity to prolonged high temperatures.
News from Cellergy (23 March 2006)
Kit offers easy intro to mixed lead-free assembly
The new PCB049 board and kit is billed as the ultimate resource for evaluating mixed-technology lead-free assembly.
News from Intertronics (23 March 2006)
Intel recognises quality of supply
DEK International has received Intel's Preferred Quality Supplier award for outstanding performance in providing products and services deemed essential to Intel's success.
News from DEK (23 March 2006)
Mass imaging process improves die attach
Processes for depositing silver epoxy and B-stage adhesives for die attach applications deliver higher throughput and repeatability as well as enhanced control over deposit characteristics.
News from DEK (23 March 2006)
Global role for Seratti
Tom Seratti is the new Vice President of Global Sales and Marketing at OK International. Brochure available
News from OK International (22 March 2006)
Manual wire bonders are low-cost intro
Low-cost manual fine wire bonders are ideal for startup companies, universities and laboratories.
News from Inseto (UK) (22 March 2006)
Hot designs need a stronger bond
Technical background article Heat-activated film answers many of the bonding challenges posed by design miniaturisation, but its efficient placement is a further challenge in itself.
News from AccuPlace (21 March 2006)
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