PCB Assembly Equipment, Tools
(a sub category of Electronics Manufacturing, Packaging)
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Brochure highlights identification products
Tyco Electronics has published a capabilities brochure to illustrate the scope of its Critchley, idento and Raychem brand product ranges.
News from Tyco Electronics - Identification Products, Nov 27, 2001
Fume extraction unit won't break the bank
Kaisertech's new KT4 fume extraction unit has been designed to remove toxic fumes and vapours from the workbench.
News from Kaisertech, Nov 22, 2001
Cleaner stencils reduce reject rates
Kerry Ultrasonics has produced a stencil cleaner that significantly reduces SMD manufacturers' reject rates.
News from Kerry Ultrasonics, Nov 20, 2001
Inline printer puts BGA bumps on 300mm wafers
Ekra has released the X5-WAF, a new inline wafer bumping system.
News from Ekra, Nov 15, 2001
Large-format inline stencil printer
With a print area of 36 x 24in, the E5-36 from Ekra offers the largest board size capability available today in an inline fully automatic printer.
News from Ekra, Nov 14, 2001
Greener solvent proves more effective
PCB assembler Electronic Technicians Ltd has seen an improvement in cleaning quality and a reduction in reject rates after the installation of a cosolvent cleaning system from Kerry Ultrasonics.
News from Kerry Ultrasonics, Nov 13, 2001
Component press-in machine makes new sense
The new CPM Prestige from Harting is a semiautomatic component press-in machine combining short cycle times, advanced sensing technology and an easy-to-use graphics interface.
News from Harting, Nov 7, 2001
Two heads are better than one for flip chip bonder
The PESL DB5-TSV vertical-head ultrasonic flip chip bonder can be rapidly converted to horizontal ultrasonics and can be used as a highly accurate pick and place machine.
News from Production Equipment Sales, Oct 30, 2001
Don't just take DEK's word for it
DEK's message to the electronics market throughout 2001 has been that its enthusiastic and creative attitude results in the achievement of real business objectives for customers.
News from DEK, Oct 18, 2001
Smart route to lead-free hand soldering
Switching to lead-free hand soldering need not demand new soldering equipment or processes thanks to an established iron technology from Metcal.
News from Metcal, Oct 17, 2001
Enclosed head printing gains support worldwide
Enclosed-head screen printing was introduced to the electronics assembly industry in 1997, and aimed to reduce materials wastage, minimise operator intervention and tighten process control.
News from DEK, Oct 9, 2001
Press-fit technology improves throughput
Sanmina Dublin, the leading contract manufacturer to the electronics manufacturing services market, has invested in advanced servoelectric press-fit technology from ASG, part of Tyco Electronics.
News from Tyco Electronics - Global Application Tooling, Oct 9, 2001
Improved printing on show in Munich
The latest additions to DEK's ProFlow product family will break cover at Productronica this November.
News from DEK, Oct 5, 2001
Printers improve their image
DEK has upgraded its ProFlow DirEKt imaging system to enhance its effectiveness and applications.
News from DEK, Oct 4, 2001
Production equipment goes online
Electronic production equipment specialist Kaisertech has opened its online shop at www.kaisertech.co.uk.
News from Kaisertech, Oct 2, 2001
Programmable baths clean consistently
Kerry has developed bench-top ultrasonic cleaning baths which can be programmed to maximise the quality and repeatability of results.
News from Kerry Ultrasonics, Oct 2, 2001
Semiautomatic component press-in machine on show
At Productronica Harting is featuring the latest developments in its range of component press-in machinery.
News from Harting, Sep 26, 2001
Three-piece lead reconditioning system
PESL now offers a viable solution to bent, misaligned or mangled leads, with a manually operated three-piece lead reconditioning system from Fancort.
News from Production Equipment Sales, Sep 21, 2001
Stripper speeds crimping process
A new development from Tyco Electronics represents a significant step forward in crimp press technology.
News from Tyco Electronics - Global Application Tooling, Sep 21, 2001
Splicers claim faster and easier operation
Furukawa Electric Europe is claiming a world-leading breakthrough in the speed and ease of use of optical-fibre splicing technology, to be unveiled at next month's ECOC show in Amsterdam.
News from Furukawa Electric Europe, Sep 12, 2001
Hot bar bonder tackles many tasks
Kaisertech has introduced the low-cost MicroJoin model 2100 pulsed heat hot bar bonder that integrates the critical features and functions needed for soldering, heat seal or ACF bonding
News from Kaisertech, Sep 5, 2001
Robot dispenses with liquids and pastes
The new I and J Fisnar I and J2400 dispensing robot from Intertronics dispenses liquids and pastes in dots, lines or arcs.
News from Intertronics, Aug 20, 2001
Rework system provides even heating
The Sniper-WB, available from Kaisertech, has been developed to rework PCBs as small as 51 x 51mm right up to 508 x 610mm, and even larger boards can be accommodated by special request.
News from Kaisertech, Jul 17, 2001
DEK downsizes, cutting 120 jobs worldwide
DEK has implemented a downsizing operation at its Weymouth manufacturing headquarters and overseas locations, involving 120 redundancies.
News from DEK, Jun 25, 2001
Dispense with high-viscosity structural adhesives
Designed to process high-viscosity materials, the SeeFlo 494 is ideally suited for dispensing structural adhesives.
News from Integrated Dispensing Systems, Jun 25, 2001
Showing 1051-1075 of 1113 articles
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