PCB Assembly Equipment and Tools

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Alliance targets solar cell manufacturing

DEK and BTU's new alliance will be officially unveiled at the 22nd European Photovoltaic Solar Energy Conference.

News from DEK ( 5 September 2007)

Imaging company opens Chinese facility

DEK has opened a state of the art manufacturing facility in Shenzhen, China as part of its ongoing strategic expansion programme in the region.

News from DEK (31 August 2007)

Hard disc cleaning technology improves reliability

User application article Guyson Supercleaner can remove sub-micro contamination from disk drive components. Brochure available

News from Guyson International (24 August 2007)

Electronics packaging company purchases dispenser

User application article The Camalot FX-D is a very flexible system that can be retrofitted to meet the changing production needs of any organisation.

News from Contax (22 August 2007)

Software optimises pick and place machines

The open architecture of AMS means that customers can either use their own line and machine optimisation software, or buy a complete package from Assembleon.

News from Assembléon (20 August 2007)

Mechanical splicer claims outstanding usability

Universal mechanical splice system is capable of splicing all standard telecomms fibre from 250 to 900um with a single-handed action.

News from Fujikura Europe ( 7 August 2007)

Shenzhen plant to play major global role

A new state-of-the-art manufacturing facility in Shenzhen is expected to account for 50% of DEK's total worldwide production by the end of 2007.

News from DEK ( 3 August 2007)

Cleaning up on larger substrates

Machine provides simultaneous double sided cleaning of large format substrates for use in PCBs and flat panel displays.

News from Teknek Manufacturing (19 July 2007)

Ball bonder emulates wedges

Wedge emulation technology makes a ball bonder a viable and flexible alternative to a wedge bonder.

News from Palomar Technologies (13 July 2007)

Materials management is key to manufacturability

Process-enabling system brings high volume production to products that might not otherwise be viable.

News from DEK (12 July 2007)

Carrier cuts down on alignment processes

Novel substrate centring and carrier technology enables multiple component support and alignment during screen printing and all subsequent assembly processes.

News from DEK (10 July 2007)

Selective soldering meets engineering challenges

User application article Jaltek's new selective soldering system replaces an existing soldering machine that did not fulfil its purpose.

News from Contax (29 June 2007)

Placement systems reduce downtime

User application article System flexibility and expandability and offline programming capabilities were key factors when G and B Electronics specified its latest two placement systems. Brochure available

News from Kaisertech (26 June 2007)

Two-component dispenser gets to the point

Handheld dispenser is claimed to be ideal for dispensing in tighter spaces or handling smaller sized applications such as those found in the electronics industry.

News from Mixpac Equipment (26 June 2007)

Rework station passes the test

User application article The high cost of contracting out rework led Lancashire-based Hawk Electronics to invest in a dedicated rework station.

News from Blundell Production Equipment (25 June 2007)

Dispensing robot cleans up on coating

User application article Trials prove novel method for automatically applying conformal coating to PCB areas surrounding contacts that may be sensitive to possible spray contamination.