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Electronics Manufacturing Services
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EMS solutions to be introduced in Munich
IMI or Integrated Microelectronics will showcase its complete solutions in electronica 2004 Trade Show from 09 to 12 November in New Munich Trade Fair Centre in Germany.
News from Integrated Microelectronics ( 8 November 2004)
Best practice publication revised
BSI Business Information has revised and renamed its best practice publication for design engineering BS 8888:2004 Technical Product Specification.
News from BSI Business Information ( 5 November 2004)
Third new lead-free-capable SMT line for CIL
CIL, the Whitchurch based electronics manufacturing and design company, has installed another completely new, fully automated surface mount line.
News from CIL Custom Interconnect ( 1 November 2004)
65nm technology for advanced chip development
Silicon Valley Technology Center has become the first R and D services provider offering 65nm silicon processing capabilities to third-party companies.
News from Cypress Semiconductor (28 October 2004)
Company develops procurement through NVQ
Colleagues at a leading Yorkshire electronics company have celebrated achieving their NVQ qualifications in a special ceremony conducted this week on the GSPK Technology Park in Knaresborough.
News from GSPK Electronics (28 October 2004)
Allendale expands UK engineering
Allendale Electronics has moved into newly developed and larger UK engineering and test areas to keep up with the growing demand for its services.
News from Allendale Electronics (22 October 2004)
Top manufacturing support at offshore prices
Tenstep uses manufacturing facilities in the UK and Tunisia to provide customers with a complete manufacturing service at offshore prices with the support levels associated with UK manufacture.
News from Tenstep (18 October 2004)
New system produces faster quotes
A leading Yorkshire electronics company has revolutionised its internal processes by writing and developing its own software to enhance its customer service provision.
News from GSPK Electronics (17 September 2004)
TTems wins new MM6 contract from S and I
TTems has been awarded its second contract from Switchgear and Instrumentation (S and I).
News from TT ems (13 September 2004)
Expansion at Cheshire assembly business
CCS Electronics has hired 15 new staff, and increased its turnover by 15% following success in winning high technology assembly contracts.
News from Abacus Group ( 8 September 2004)
EMS provider expands into Germany
Advanced Input Systems is expanding its European presence with a new office for Germany, Austria and Switzerland.
News from Advanced Input Systems ( 3 September 2004)
Displays shipped to Seiko Epson
IMI has made its first shipment of liquid crystal display (LCD) modules for cellular phones for its customer Seiko Epson Corp.
News from Integrated Microelectronics (31 August 2004)
Scott has designs on CIL
CIL, the Whitchurch based contract design and manufacturing company, has appointed Gordon Scott as Senior Design Engineer.
News from CIL Custom Interconnect (30 August 2004)
Lead-free assembly line is up and running
Following extensive trials, Weymouth based contract electronics manufacturing company Ultra Electronics Manufacturing Services has introduced a lead-free soldering process.
News from Ultra Electronics Manufacturing Services (30 August 2004)
IMI aims for bigger share of global market
Integrated Microelectronics is spending the whole month of August celebrating its 24-year anniversary.
News from Integrated Microelectronics (17 August 2004)
From silicon die to full custom BGA assembly
CIL now has the capability to provide the full production process from silicon die to custom ball grid array (BGA) assembly.
News from CIL Custom Interconnect (12 August 2004)
EU expansion provides market opportunities
Latest developments within the EU have brought new target market opportunities to a Yorkshire based subcontract manufacturing company.
News from GSPK Circuits (27 July 2004)
Optical encoder discs made to (exact) order
Optical encoder disc designers and specifiers requiring cost-effective, accurate and durable solutions, now have access to what is believed to be the most versatile manufacturing facility in Europe.
News from Tecan Components (27 July 2004)
Wafer bonder improves MEMS gyro
Technical background article The throughput and performance of wafer bonding tools can play a key role in determining the cost of assembly and packaging of MEMS and other microsystems devices.
News from Applied Microengineering (20 July 2004)
Clean room expands manufacturing capabilities
CTL Manufacturing has added a clean room as well as crop and preform capabilities for through-hole components, to enhance its assembly services portfolio.
News from CTL Manufacturing (14 July 2004)
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