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Recruitment, Reports and Resources
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GaAs device manufacturers see strong profits
GaAs and compound semiconductor technologies analysis shows an industry moving into profitability.
News from Strategy Analytics (23 March 2007)
Partners investigate system-in-package design
A new project-based partnership is working to enable the successful introduction of a new system-in-package approach to electronics design and construction.
News from Adept-SiP Consortium (23 March 2007)
Show report details power amp mix
Suppliers of power amplifiers, front-end modules and transceivers emphasised their strong product mixes to provision custom solutions at handset OEMs at 3GSM 2007.
News from Strategy Analytics (22 March 2007)
Power Architecture conference calls for papers
Design engineers are invited to submit proposals around technology innovations and practical design information for the first-ever vendor-neutral Power Architecture Developer Conference.
News from Power.org (22 March 2007)
Researchers unite to measure embedded development
Two market analysis firms are joining forces to jointly develop a set of metrics to describe the efficiency of current embedded systems development practices.
News from Strategy Analytics (21 March 2007)
Two new Directors Emeritus for SEMI board
Two industry veterans, both of whom have formerly held the post of Chairman of SEMI, have been appointed to the board of the industry association SEMI as Directors Emeritus.
News from SEMI (21 March 2007)
Forum releases technical reports and elects board
The DSL Forum has released its latest Technical Reports (TRs) and the results of elections held at its annual meeting in Vancouver, Canada, from 5th to 8th March, 2007.
News from DSL Forum (21 March 2007)
Standards organisations in patent harmony
The world's leading international standards organisations have adopted a harmonised approach to address the inclusion of patented technology in standards.
News from IEC (International Electrotechnical Commission) (20 March 2007)
IC manufacturing kit expands globally
SEMI reports that worldwide sales of semiconductor manufacturing equipment totalled US $40.47 billion in 2006, representing a year-over-year increase of 23%.
News from SEMI (20 March 2007)
Strong growth in semiconductor equipment
North American-based manufacturers of semiconductor equipment posted US $1.65 billion in orders in February 2007 and a book-to-bill ratio of 1.05.
News from SEMI (19 March 2007)
Benchmark figures for embedded PowerPC processor
New benchmark scores for IBM's PowerPC 750CL embedded processor provide extensive data on the "cost" of processor performance for the chip across several distinct application areas.
News from EEMBC (16 March 2007)
M2M increases share of US cellular connections
The number of machines connected to cellular networks in North America is forecast to reach 66 million by 2011.
News from Berg Insight (16 March 2007)
Halogen-free database project started
The High Density Packaging User Group International (HDP) has started a project to create a distributed database on the properties and availability of halogen-free electronic components and materials.
News from HDP User Group (16 March 2007)
Report outlines promise of 40Gbit/s networking
Telecommunications equipment manufacturers will purchase approximately US $500 million worth of 40Gbit/s transponders and components by 2012, according to new market research.
News from CIR (15 March 2007)
LED drivers prosper in handset flash market
The current trend towards cameras with flash in mobile phones offers a significant opportunity for manufacturers of driver ICs for LEDs.
News from IMS Research (15 March 2007)
Free take-back service for WEEE compliance
Leading WEEE compliance scheme will collect, any and all WEEE made freely available in all categories, from any local authority.
News from Repic (13 March 2007)
Healthcare markets provide UPS opportunities
European healthcare UPS markets earned revenues of Eur 108 million in 2006 and are projected to reach Eur 216.1 million in 2013.
News from Frost and Sullivan (13 March 2007)
The future of European electronics interconnection
Document describes how key factors such as lead-free soldering, sustainability and miniaturisation are impacting on interconnection supply chain, materials and processes.
News from Elfnet (13 March 2007)
Mobile comms continues to drive IC sales
Continued demand for communications and portable computing devices with innovative new features will drive purchases this year and help boost sales of the semiconductors used in these products.
News from Semico Research (13 March 2007)
Fault tolerance becomes automotive necessity
The proliferation of electronic content in automobiles will further underline the importance of fault-tolerant electronic components to minimise errors and avoid accidents.
News from Frost and Sullivan ( 7 March 2007)
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