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News Release from: Advanced Systems Automation (Europe) | Subject: RTC WaferBump
Edited by the Electronicstalk Editorial
Team on 02 September 2002
Conduction oven heats bumps more evenly
Radiant Technology Corp has developed the world's first conduction conveyor oven that reflows solder bumps without wrinkles and voids.
Radiant Technology Corp has developed the world's first conduction conveyor oven that reflows solder bumps without wrinkles and voids With RTC's new WaferBump system, flip-chip semiconductor manufacturers no longer have to choose between high-quality solder bumps or high-volume automation
This article was originally published on Electronicstalk on 18 Feb 2003 at 8.00am (UK)
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Solder bumps, those microscopic balls of solder that electrically connect flip-chip integrated circuits to packages or circuit boards, need to be solid and smooth for performance and reliability.
Conduction heating is the best method for quality bump formation compared with convection heating technology.
Convection ovens have turbulent atmospheres that dry the flux and solder paste at uneven rates, resulting in a broad distribution of bump quality across the wafer.
Heating and cooling occurs from the top down.
On the other hand, conduction heating silicon wafers is an equilibrium process.
The high thermal conductivity of silicon guarantees uniform heating across the wafer from the bottom up.
Reprofiling for different products is minimised.
Building on its infra-red heating and atmosphere management expertise, RTC developed an oven that uses infrared lamps below the conveyor to heat a dense-weave HotBelt.
After solder reflow, the wafer is transferred to a ColdBelt where it is quickly cooled.
This multibelt system offers the preferred conduction heating technology for wafer bumps along with the automation benefits of a continuous conveyor (patents pending).
The WaferBump oven also uses RTC's patented gas management system for a low velocity, laminar flow nitrogen atmosphere that keep oxygen levels below 10ppm.
Oven features include a split chamber with powered vertical lifts for full interior access, a flux collection system, UPS, a SMEMA interface and noncontact infra-red temperature sensors that monitor each wafer's temperature and location.
RTC offers a complete SECS/GEM reflow system with oven, FOUPs, robots, a flux coater, buffer and notch aligner.
(This was Electronicstalk's Top Story on 30 August 2002).
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