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News Release from: Adept-SiP Consortium
Edited by the Electronicstalk Editorial
Team on 23 March 2007
Partners investigate system-in-package
design
A new project-based partnership is working to enable the successful introduction of a new system-in-package approach to electronics design and construction.
Adept-SiP, a new project-based partnership funded through the DTI's technology programme, is working to enable the successful introduction of a new system-in-package approach to electronics design and construction The project partners are developing a rigorous, right-first-time, design and supply chain management methodology for novel system-in-package (SiP) electronics product functions
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Adept-SiP Project Manager, David Pedder commented: "The lack of a robust design methodology has, until now, held back the widest possible adoption of the SiP approach".
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"SiP designs can be more cost-effective, with improved performance and functionality, and reduced time to market".
"Board level functionality can now be realised at the package level and the approach is well matched to a wide range of low, medium and high volume electronics product applications".
Funded for a 30 month term, the Adept-SiP project will implement technologies for SiP schematic capture, partitioning and for active device, substrate and package design.
The partnership's designs will address specific performance, cost, size and weight targets.
Other key design development stages will include thermal management, EMC and design-for-manufacture, and design-for-test, reliability and environmental impact will also be addressed.
Further benefits are promised by the addition of embedded passive component technology, enabling improved SiP performance with further reduction in size, weight and cost.
Novel, high-density embedded passive substrate technologies will be designed and simulated.
Process characterisation will be undertaken and component models developed for the full range of passive components, interconnection and assembly structures.
The core design, simulation and modelling activities will then be proven in SiP technology demonstrators.
The Adept-SiP project is funded through the DTI Technology Programme under the Design, Simulation and Modelling Technology priority area.
Project partners include both Filtronic Broadband, based in Newton Aycliffe and Zarlink Semiconductor's Advanced Packaging Division based in Caldicot as SiP product end-users.
Leeds University is a modelling provider.
Zuken, QuantumCAD and Flomerics are design providers, and Wurth Elektronik and TWI are technology providers.
Further information on the Adept-SiP project may be obtained from the project website.
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