Product category:
Programmable Logic Devices
News Release from: Actel Europe | Subject: eX FPGAs
Edited by the Electronicstalk Editorial
Team on 02 April 2003
FPGA storage is unaffected by moisture
Actel has received moisture-sensitivity level 2 certification of its eX family of field-programmable gate arrays in chip-scale packaging.
Actel has received moisture-sensitivity level 2 (MSL2) certification of its eX family of field-programmable gate arrays (FPGAs) in chip-scale packaging (CSP) A JEDEC standard, MSL2 guarantees a one-year shelf life for packages stored at a fixed temperature in an uncontrolled environment, offering customers greater flexibility for storage and manufacturing, all without compromising system reliability
This article was originally published on Electronicstalk on 2 Aug 2004 at 8.00am (UK)
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For packages with higher MSLs, the shelf life deteriorates significantly.
Consequently, the manufacturer may add a dry-bake or rebake step, often required prior to mounting the package on a board or module, in their process.
The baking process requires dry bags, trays for baking, moisture indicators, desiccant material, controlled-environment storage and various other logistic challenges, including product staging.
These processes increase costs as well as cycle time.
First introduced in September 2000, the eX family consists of three devices: the eX64, eX128 and eX256 with system gate densities of 3000, 6000 and 12,000, respectively.
Actel offers a range of chip-scale packages, including 49-, 128- and 180-ball packages.
The MSL2-certified eX FPGAs in CSP are available now at the same competitive prices as Actel's standard products.
For further information about volume pricing and availability, please contact Actel.
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