Product category:
Programmable Logic Devices
News Release from: Actel Europe | Subject: RT54SX32S-CC256M
Edited by the Electronicstalk Editorial
Team on 05 December 2003
Novel package puts programmed FPGAs in
space
A novel advanced packaging technology is small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for space applications.
A novel advanced packaging technology is small enough to enable the assembly of tested and programmed FPGAs into multichip modules (MCMs) for space applications Capable of delivering products with a form factor similar to bare die, the new ceramic chip carrier land grid (CCLG) package eliminates the handling, testing and programming challenges associated with using known good die (KGD) in MCMs
This article was originally published on Electronicstalk on 5 Aug 2008 at 8.00am (UK)
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The first product based on this technology, the RT54SX32S-CC256M, is factory tested at both extremes of the military temperature range and at room temperature prior to shipment.
"Actel's designed-for-space antifuse FPGAs offer a highly reliable, low-risk solution, which is especially important for mission-critical applications", said Ken O'Neill, Director, Military and Aerospace Product Marketing at Actel.
"In the space industry, where board area is at a premium, die-size solutions allow for the integration of different technologies in multichip modules.
With our tried-and-tested RTSX-S technology and the CC256 package, Actel has overcome the dilemma of programming and testing at the die level to offer a compelling alternative to KGD products".
Custom designed by Actel for its 32,000-gate, radiation-tolerant, military temperature grade RT54SX32S device, the 17 x 17mm CCLG256 package is 78% smaller than its predecessor, the CQFP256.
The underside of the package is a 256-pad land grid array with 1.0mm pad spacing, which enables reliable programming using programming modules supported by Actel's Silicon Sculptor II Programmer.
In operation, the underside of the package is attached to the MCM substrate using an electrically nonconductive, thermally conductive attach material.
The topside of the package features 256 bonding fingers, to which bond wires are attached to complete the electrical connections to other components within the MCM.
The package is hermetically sealed and employs the inherent radiation tolerant benefits of the RTSX-S architecture, including single-event latchup (SEL) immunity; better than 37MeV-cm2/mg single-event upset (SEU) capability; and total ionising dose (TID) performance in excess of 100krad.
The CCLG256 package for RT54SX32S is available now.
An application note, titled "Ceramic chip carrier land grid (CC256) package handling", is available on Actel's website.
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