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Advanced Interconnections Corp

Address:
5 Energy Way
West Warwick
RI 02893
USA
Telephone: (USA) +1 401 823-5200

http://www.advintcorp.com

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Listing of all 19 news releases from Advanced Interconnections Corp:

Terminal carriers come in custom configurations

Peel-A-Way carriers can be easily removed after soldering for complete visibility or left in place for added stability.

News from Advanced Interconnections Corp ( 4 April 2008)

Interposers ease BGA device transitions

BGA interposers offer a cost-effective method for converting lead-free BGA device packages for use on boards processed with tin/lead solder profiles.

News from Advanced Interconnections Corp (25 June 2007)

PCB connectors raise I/O density

High-density SMT connector is now available in a 500-position footprint on 1.27mm pitch for high I/O board to board applications where durability and reliability are critical.

News from Advanced Interconnections Corp (15 May 2007)

BGA adapters simplify board soldering

BGA socket adapter systems solve reflow temperature mismatch issues when using lead-free devices on existing boards with standard solder profiles.

News from Advanced Interconnections Corp (16 February 2007)

Hybrid adapter offers low attenuation up to 3.5GHz

Hybrid socket adapter design uses both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints.

News from Advanced Interconnections Corp (24 January 2007)

Connectors promise reliable board stacking

High density SMT connectors offer the industry's most robust solution for 1.27mm pitch surface mount board stacking applications.

News from Advanced Interconnections Corp (28 August 2006)

BGA socket offers lead-free option

Advanced Interconnections Corp has launched its next generation Flip-Top BGA socket.

News from Advanced Interconnections Corp (11 May 2006)

BGA adapter boasts top electrical performance

A 0.50mm pitch BGA socket adapter system features a novel hybrid design using both male and female pins in an interstitial pattern.

News from Advanced Interconnections Corp (14 March 2006)

Shortform updates RoHS-compliant socket range

A new shortform catalogue features up-to-date material specifications and part numbers for RoHS compliant IC sockets and adapters for BGA, PGA, DIP and SIP packages.

News from Advanced Interconnections Corp (20 February 2006)

Terminal carriers complete RoHS compliant testing

Advanced Interconnections has recently completed RoHS compliant testing on its patented Peel-A-Way removable terminal carrier products.

News from Advanced Interconnections Corp (23 September 2005)

Sockets save sensors from assembly damage

A new line of image sensor sockets is designed to reduce costs by protecting valuable image sensors from damage during board assembly and processing.

News from Advanced Interconnections Corp (17 December 2004)

Read all about BGA socketing systems

A new BGA socketing systems brochure details the complete line of standard socketing solutions for BGA, LGA and CSP applications, including new lead-free 1.00mm pitch BGA sockets.

News from Advanced Interconnections Corp (30 July 2004)

BGA sockets kick out the lead

Lead-free solder ball terminal options are now available on selected BGA sockets to assist compliance with the RoHS Directive and other worldwide initiatives for lead-free manufacturing.

News from Advanced Interconnections Corp (29 April 2004)

BGA sockets range up to 26 rows square

A new range of 1.00mm pitch BGA sockets in precision moulded wafers offers improved hole-to-hole accuracy, reduced insertion and withdrawal forces and coplanarity within 0.15mm.

News from Advanced Interconnections Corp (24 March 2004)

New quality standard embraced

Advanced Interconnections has earned registration to ISO9001:2000, taking its well documented quality management system to the next level by focusing all efforts around meeting customer requirements.

News from Advanced Interconnections Corp (28 November 2003)

Custom boards speed BGA test throughput

Custom-engineered microchip socketed test fixture boards electrically interface test equipment to BGA packages and eliminate the time-consuming need to solder the packages to adapters.

News from Advanced Interconnections Corp ( 4 November 2003)

Speedy supply for removable terminal carriers

Advanced Interconnections Corp can now supply its patented Peel-A-Way PGA, DIP and SIP sockets and adapters and board to board connectors on a three-day lead time on all qualifying orders.

News from Advanced Interconnections Corp (10 October 2003)

Custom solution solves board interconnect woes

 User application article   When unique PC board electrical connectivity problems arise, custom socketing systems can solve them reliably and economically.

News from Advanced Interconnections Corp (19 June 2003)

Novel BGA socket cuts real estate

The Flip-Top BGA socket dramatically reduces PC board space for BGA and LGA device socketing in development, test and production applications.

News from Advanced Interconnections Corp ( 5 June 2003)

 

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