Product category:
Test Accessories
News Release from: Advanced Interconnections Corp | Subject: Custom socketed test fixture boards
Edited by the Electronicstalk Editorial
Team on 04 November 2003
Custom boards speed BGA test throughput
Custom-engineered microchip socketed test fixture boards electrically interface test equipment to BGA packages and eliminate the time-consuming need to solder the packages to adapters.
Custom-engineered microchip socketed test fixture boards electrically interface test equipment to BGA packages and eliminate the time-consuming need to solder the packages to adapters Produced for either OEM or end-user applications, Advanced Interconnections' custom test fixture boards are multilayer FR-4 assemblies incorporating cable-to-board connectors (which provide the interface to the test system) and AIC's patented True BGA socket (into which the chip packages are inserted during testing)
This article was originally published on Electronicstalk on 5 Jun 2003 at 8.00am (UK)
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The test fixture boards are typically designed with surface mount technologies using vias to make required trace-to-trace connections between the various board layers; the cable-to-board connectors are surface mounted.
The True BGA socket eliminates the need to solder the BGA to the adapter.
Only the socket itself is soldered to the board.
The BGA package under test is simply placed on top of the socket, covered with a support plate, and secured by first sliding a clamp in place over the BGA and then tightening a coin screw or heatsink.
Optimal electrical continuity is assured by the use of spring-loaded beryllium copper contacts loaded in pogo pin terminals, the heads of which are compressed against the balls of the BGA package, to create a gastight seal.
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