Product category:
Plugs and Sockets
News Release from: Advanced Interconnections Corp | Subject: Moulded 1.00mm pitch BGA sockets
Edited by the Electronicstalk Editorial
Team on 24 March 2004
BGA sockets range up to 26 rows square
A new range of 1.00mm pitch BGA sockets in precision moulded wafers offers improved hole-to-hole accuracy, reduced insertion and withdrawal forces and coplanarity within 0.15mm.
A new range of 1.00mm pitch BGA sockets in precision moulded wafers offers improved hole-to-hole accuracy, reduced insertion and withdrawal forces and coplanarity within 0.15mm The new sockets are moulded in-house by Advanced Interconnections from high-temperature thermoplastic
This article was originally published on Electronicstalk on 5 Jun 2003 at 8.00am (UK)
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The new, full-grid wafers are pin loaded to the exact footprint specified and are available in any footprint specific pattern up to 26 x 26 rows, to accommodate a BGA, LGA, or CSP device as large as 27mm square.
Larger sizes are still available in FR-4 wafers and will be available soon in high-temperature thermoplastic.
The surface mount sockets use patented eutectic solder ball terminals.
Through-hole models are available with a variety of terminal options including the popular 0.28mm-diameter tail.
Advanced's proven screw-machined terminals with multifinger contacts and gold plating ensure long-term durability and superior processing results.
The new moulded BGA sockets mate with Advanced's 1.00mm pitch BGA adapters and are also designed for test applications, enabling a through-hole test socket to be easily plugged and unplugged for use on multiple test boards.
The 1.00mm pitch moulded sockets are available with options such as custom terminal designs, polyimide film seals for automated pick and place, extraction slots to facilitate device/adapter removal, and tape and reel packaging.
Prices vary with number of positions and options selected.
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