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Product category: Plugs and Sockets
News Release from: Advanced Interconnections Corp | Subject: Lead-free BGA sockets
Edited by the Electronicstalk Editorial Team on 29 April 2004

BGA sockets kick out the lead

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Lead-free solder ball terminal options are now available on selected BGA sockets to assist compliance with the RoHS Directive and other worldwide initiatives for lead-free manufacturing.

Lead-free solder ball terminal options are now available on selected BGA sockets to assist compliance with the RoHS Directive and other worldwide initiatives for lead-free manufacturing The new sockets are moulded from high-temperature, glass-filled thermoplastic, able to withstand the higher processing temperatures required in lead-free processing (up to 276C)

Lead-free, 1.00mm pitch, BGA sockets in precision moulded LCP wafers for both surface mount and through-hole applications are available now.

The surface mount sockets feature solder ball terminals made from a tin/silver/copper alloy with a reflow temperature of 218C.

The full grid wafers are pin loaded to the exact footprint specified and are available in any footprint specific pattern up to 26 x 26 rows, to accommodate a BGA, LGA or CSP device as large as 27mm square.

Additional sizes and lead-free 1.27mm pitch sockets will be available soon.

Advanced's industry proven, screw-machined terminals with multifinger contacts and gold plating ensure long-term durability and superior processing results.

Mating adapters, custom designs, and tape and reel packaging are available.

Prices vary with number of positions and options selected.

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