Product category:
Plugs and Sockets
News Release from: Advanced Interconnections Corp | Subject: Advanced BGA socket adapter system
Edited by the Electronicstalk Editorial
Team on 16 February 2007
BGA adapters simplify board soldering
BGA socket adapter systems solve reflow temperature mismatch issues when using lead-free devices on existing boards with standard solder profiles.
BGA socket adapter systems from Advanced Interconnections Corp solve reflow temperature mismatch issues when using lead-free devices on existing boards with standard solder profiles When devices packages are transitioned to lead-free, OEMs with RoHS exempt products must change board soldering profiles and requalify existing components just to accommodate the higher processing temperatures required for proper lead-free device attach
This article was originally published on Electronicstalk on 5 Jun 2003 at 8.00am (UK)
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The added costs and time delays associated with changing profiles or redesigning boards can be avoided by using the socket adapter systems.
Using the advanced BGA socket adapter system, lead-free device packages are soldered to RoHS compliant adapters in a high temperature reflow profile.
The boards are processed with standard sockets, featuring tin/lead solder ball terminals, without changing the board soldering profile.
The device/adapter assembly is easily plugged in to the board-mounted socket after board processing.
Incorporating the advanced BGA socket adapter system into RoHS exempt designs protects components that may be sensitive to higher reflow temperatures and eliminates the need to scrap existing boards or change profiles.
Advanced also offers BGA and LGA device-to-adapter attach services and provides tape-and-reel packaging services to facilitate automated processing.
For RoHS compliant applications, advanced sockets are available with tin/silver/copper solder ball terminals.
Complete product specifications as well as an extensive database of footprints from 0.50 to 1.27mm pitch are available online.
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