Pair to promote ETXexpress brand

Kontron and Adlink are to collaborate in promoting the ETXexpress product brand to the embedded market.

Kontron and Adlink are to collaborate in promoting the ETXexpress product brand to the embedded market.

It is the first co-operation on such scale for Kontron and Adlink and both parties have the best expectations on the success on the ETXexpress products.

The co-operation covers combined brand marketing and shared use of trade names, as well as ensuring ETXexpress branded products follow the standard.

Kontron introduced the new module standard with Intel back in November 2003, with an active working group working on the standard development the definition is prospering and call for participation with the PICMG has been issued.

"To have an industry leader like Adlink participating in the ETXexpress promotion will ensure a strong product brand recognition in the embedded marketplace", says Matthias Huber, Product Manager for ETXexpress.

"This will ensure that ETXexpress will become as well accepted as ETX was before", adds Huber.

"As part of the initiative, Adlink will team up with Kontron and fully support the new ETXexpress product lines", says Jeff Munch, Chief Technology Officer of Adlink.

"This exciting collaboration with Kontron will provide large and small manufacturers with a foundation to quickly bring powerful PCI Express based products to the market", indicates Munch.

ETXexpress will support up to eight PCI Express x1 lanes and PCI Express graphics as well as established hardware solutions based on current busses such as 32bit PCI and ISAbus (via a LPC).

A 10/100/1000Mbit/s Ethernet port provides fast connectivity to LAN/WAN and up to eight USB 2.0 interfaces provide for external drives/Flash, keyboard, mice and other peripherals.

ETXexpress modules also will provide the following interfaces that are always located in the same physical position on each board, thus guaranteeing scalability between modules: serial ATA, parallel ATA, LVDS multimedia ports as well as an ACPI (Advanced Configuration and Power Interface) for optimised power management.

The new standard is planned to be initially offered in a 90 x 125mm form factor.

Signals are brought out via high-pin-count SMT connectors that permit data transmission rates up to 5GHz.

Six mounting holes on the board provide resistance to shock and vibration.

The thermal coupling system incorporates a standardised heat spreader, as is the case with ETX.

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