ETXexpress module shows up in Nuremburg

Adlink Technology is showing off an all-new line of computers on modules (COMs) based on the new ETXexpress form factor at the Embedded World 2005 exhibition in Nuremburg, Germany.

Adlink Technology is showing off an all-new line of computers on modules (COMs) based on the new ETXexpress form factor at the Embedded World 2005 exhibition in Nuremburg, Germany.

ETXexpress is a result of the convergence of the latest technology standards based on serial differential signalling such as PCI Express, USB 2.0, Serial ATA, LVDS and Serial DVO implemented on an extremely compact computer on module.

Adlink will market its new line of COMs under the name ETXexpress, together with Kontron and Advantech.

ETXexpress specifications are identical to the new COM Express specification currently being developed by PICMG.

The first Adlink ETXexpress module to be released in Q2 2005 is the ETXp-IA533, based on the Intel Pentium M Processor 760 running at 2.0GHz with 533 front-side bus and the Mobile Intel 915GM Express chipset for the embedded market.

"For many years COMs have trailed in performance and technology compared with standard form factors", says Henk van Bremen, Product Manager of Embedded Computing at Adlink.

While most of these form factors, such as ATX, SBC and CompactPCI, are able to closely follow the latest chipset technology, x86 based COMs have not been able to follow into areas such as 64bit PCI and high performance CPUs.

For high-end solutions, OEMs either relied on bulky standard form factors or expensive and time consuming proprietary designs.

"With the introduction of ETXexpress, which is based on the new high speed differential signalling bus, PCI Express, computers on module are closing the technology gap and can go centre stage for high-end OEM applications".

"In addition ETXexpress has a value proposition that is hard to beat", concludes van Bremen.

"COM Express solutions based on Intel products such as the Intel Pentium M Processor 760 and the Mobile Intel 915GM Express chipset, are the platforms of choice for OEMs looking to quickly deliver high performance, low power embedded applications", said Doug Davis, Vice President, Digital Enterprise Group, General Manager, Infrastructure Processor Division, Intel Corp.

As most of the new COMs are to be based on processors and chipsets that will be used in mass markets such as notebooks, the cost/performance level will soon outpace all other high-end solutions on the market today.

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