Product category:
Embedded Computing and Control
News Release from: Adlink Technology | Subject: ETXp-IA533
Edited by the Electronicstalk Editorial
Team on 14 March 2005
Computer on module closes performance
gap
Adlink Technology will showcase the first member of a new generation of computers on modules (COMs) called ETXexpress at CeBIT 2005 in Hanover, Germany.
Adlink Technology will showcase the first member of a new generation of computers on modules (COMs) called ETXexpress at CeBIT 2005 in Hanover, Germany ETXexpress modules are based on the new PICMG form factor called COM Express, the convergence of the latest technology standards based on serial differential signalling such as PCI Express, USB 2.0, SATA, LVDS and Serial DVO
This article was originally published on Electronicstalk on 23 Feb 2005 at 8.00am (UK)
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ETXexpress module shows up in Nuremburg
Adlink Technology is showing off an all-new line of computers on modules (COMs) based on the new ETXexpress form factor at the Embedded World 2005 exhibition in Nuremburg, Germany.
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These standards are implemented on a compact 95 x 125mm computer on module.
Signals are brought out through two 220-pin board-to-board connectors that permit data transmission rates of up to 5GHz.
Six mounting holes connect the module with a custom-made, application specific carrier boards which provide protection from shock and vibration.
The first member of Adlink's ETXexpress family, the ETXp-IA533, uses a low power Intel Pentium M Processor 760 at 2.0GHz and the Mobile Intel 915GM Express chipset.
Both chipset and processor are part of the Embedded Intel Architecture (IA) that warrants long production life for applications that need extended availability.
The ETXp-IA533 supports dual channel DDR2 533MHz memory and comes with a single onboard gigabit Ethernet port.
In addition to the onboard integrated graphics, a Graphic PCI Express x16 slot is available.
The board allows connection of up to four additional PCI Express x1 devices.
The module has legacy support for 32bit PCI and ISA through LPC.
Samples of the ETXexpress ETXp-IA533 will be available in early Q2 of 2005.
"For many years computers on module have trailed in performance and technology compared with standard form factors", says Henk van Bremen, Product Manager of Embedded Computing at Adlink.
"With the introduction of ETXexpress, which is based on the new high speed differential signalling bus, PCI Express, COMs are closing the technology gap and can go centre stage for high-end OEM applications".
"In addition ETXexpress has a price-to-performance ratio that is hard to beat", concludes van Bremen.
The modular concept of off-the-shelf core modules combined with custom made carrier boards greatly reduces customers' time-to-market and allows them to focus on their core competitiveness.
Adlink currently offers several types of ETX modules which are PCI/ISA based COMs for low to medium level performance and the new ETXexpress line for cutting edge high performance based on the PCI Express bus. Request a free brochure from Adlink Technology ...
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