Product category:
Electronics Manufacturing Materials and Consumables
News Release from: AdTech Ceramics | Subject: Custom microwave and RF IC packages
Edited by the Electronicstalk Editorial
Team on 20 August 2004
Novel design process boosts package
performance
A new custom package design process can yield market differentiating performance while maintaining cost effective solutions.
AdTech Ceramics has a new design process using state of the art 3D finite element method (FEM) simulators and proprietary numerical simulators that can yield market differentiating performance while maintaining cost effective solutions Custom microwave and RF IC packages can be modelled from 2 to 60GHz with transitions and interconnects which require extremely complex and accurate simulation to meet customer expectations
This article was originally published on Electronicstalk on 25 Jun 2004 at 8.00am (UK)
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New source for high-reliability ceramic packaging
Advanced Technical Ceramics Company has established a multilayer cofired ceramic facility in Chattanooga, Tennessee.
The alternative is to resort to the old cycle of fab, test and redesign.
The AdTech solution offers world class performance with cost-competitive ceramic packaging solutions.
An example of AdTech's capability can be seen in a 3D electromagnetic simulation of a ceramic IC package.
The heart of the AdTech approach blends finite element method (FEM), method of moment (MOM), variational method solutions and automated optimisations.
This combination allows us to converge on solutions quickly and accurately.
The process usually results in first pass successes, even for complex packages, that reduce development cost and improve time to market. Request a free brochure from AdTech Ceramics ...
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