Ceramic packaging expertise on show in Munich
An
AdTech Ceramics product story
Edited by the Electronicstalk editorial team
Sep 6, 2004
AdTech Ceramics will introduce its multilayer cofire ceramic capabilities at Electronica 2004.
AdTech Ceramics will introduce its multilayer cofire ceramic capabilities at Electronica 2004.
The company's manufacturing facility has a long history of designing, tooling and manufacturing multilayer ceramic packaging and feedthroughs.
Products and capabilities available in cofired multilayer ceramics include: custom advanced packages; multichip modules, substrates and packages; microwave packages; high-frequency feedthroughs; power dissipation packages; optical packages; high-lead-count packages; custom pin grid arrays; microwave design assistance; and chemical milling of Kovar lids and lead frames Advanced Technical Ceramics Company is a sister company of Statek Corp in Orange, California.
The company can be found at Electronica 2004 on Statek's Stand B5-619 from 9th to 12th November.
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Other AdTech Ceramics stories
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Adtech releases multi-layer ceramic feedthroughs
Adtech Ceramics has introduced custom hermetic feedthroughs that use multi-layer co-fire technology, for microwave, spectrometry, high power and high frequency applications up to 30GHz. -
Adtech and Statek to attend Electronica
Adtech Ceramics will participate in Electronica 2008, with sister company Statek Corporation of California, this year in area B6, booth 456. -
Adtech unveils microwave packaging capabilities
AdTech Ceramics' microwave packaging capabilities include hermetic Alumina High Temperature Cofired Ceramic (HTCC) and Aluminum Nitride (AIN) in the X through K band frequency ranges. -
Chemical milling is backed by experience
Product capabilities include gold plated step lids for seam seal applications, lead frames, seal rings and other applications. -
Thin-film substrate is easier to process
Novel HD alumina substrate offers straight through vias for thin-film applications.
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