Ceramic processes explained by product guide
An
AdTech Ceramics product story
Edited by the Electronicstalk editorial team
Mar 21, 2007
AdTech Ceramics, specialising in advanced technical ceramic solutions in a wide variety of materials, has published a new design and capabilities guide.
AdTech Ceramics, specialising in advanced technical ceramic solutions in a wide variety of materials, has published a new design and capabilities guide.
This new guide details AdTech's available products, including injection moulding, chemical milling, high frequency feedthroughs, custom pin grid arrays and pad array carriers, as well as custom advanced, microwave, optical, sensor and crystal/oscillator/SAW packages.
An overview of the cofire multilayer ceramic process is also provided, as well as ceramic specifications for HTCC/HD alumina and AlN to assist in materials selection.
In addition, guidelines for structural, interconnect, and special features and components for highly custom applications, are included.
Additional products and special design capabilities including Pt cofire HTCC, HD Alumina (matching thin film with HTCC), ceramic metal packaging, self-aligning seal rings and pedestals, microwave design assistance and refractory metal standoffs are also discussed.
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Other AdTech Ceramics stories
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Adtech releases multi-layer ceramic feedthroughs
Adtech Ceramics has introduced custom hermetic feedthroughs that use multi-layer co-fire technology, for microwave, spectrometry, high power and high frequency applications up to 30GHz. -
Adtech and Statek to attend Electronica
Adtech Ceramics will participate in Electronica 2008, with sister company Statek Corporation of California, this year in area B6, booth 456. -
Adtech unveils microwave packaging capabilities
AdTech Ceramics' microwave packaging capabilities include hermetic Alumina High Temperature Cofired Ceramic (HTCC) and Aluminum Nitride (AIN) in the X through K band frequency ranges. -
Chemical milling is backed by experience
Product capabilities include gold plated step lids for seam seal applications, lead frames, seal rings and other applications. -
Thin-film substrate is easier to process
Novel HD alumina substrate offers straight through vias for thin-film applications.
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